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  • 學位論文

薄型矽晶太陽電池之基板與電池製造技術研究

The Substrate and Cell Manufacture Process of Thin Film Crystalline Silicon Solar Cell

指導教授 : 葉 哲 良
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摘要


本論文研究超薄矽晶太陽電池之製作,尤其是無切割損太陽電池技術的相關技術,以減少矽晶太陽電池的矽材用量,促進矽晶太陽電池的成本之降低。在本論文中,我們首先針對薄型矽晶片的各種特性進行研究,其使用方法包括了電腦元件模擬,以探討矽的塊材品質、表面再結合速率、與晶片厚度對於太陽電池表現之影響,界定晶片薄化所造成的光吸收降低,為影響效率的最大因素。同時以化學減薄的方法製作不同結構的薄晶片太陽電池,包括標準結構太陽電池、選擇性射極太陽電池、以及背面鈍化太陽電池,發現低摻雜射極以及背表面鈍化,皆對於開路電壓及效率的提升有相當的效益,但最大的增益來自背面鈍化太陽電池的背面光反射效果所造成之光電流的提升。 另外,本論文嘗試了兩種無切割損的晶片及太陽電池製作方式,包括了熱應力圖案轉印以及金屬應力剝除法。熱應力圖案轉印法利用具有圖案化結構的藍寶石基板,在其上沉積矽膜後剝離,可將藍寶石基板的圖案轉印到矽基板上,製作無需光罩的奈米及蜂巢狀光吸收結構。而金屬應力剝除法,可自矽晶片上剝除約40微米的超薄矽層,在去除剝離金屬及玻璃狀殘留物後,配合異質接面太陽電池製程,可將效率提升到14.7%。這個結果提供了我們物理及實驗上的基礎,以做為未來發展無切割損高效率矽晶太陽電池的根基。

關鍵字

太陽電池 結晶矽 薄晶片

並列摘要


This thesis investigates the fabrication of thin crystalline silicon solar cell, especially the kerf-loss less solar cells. This technology can reduce the silicon usage of c-Si solar cell and decline its cost. In this study, we used the device simulation tool to discuss the effects of silicon bulk lifetime, surface recombination velocity, and wafer thickness to the properties of solar cell, and determined that the decline of light absorption is the main issue of thin crystalline solar cells. We also fabricated thin crystalline silicon solar cell of different structure, such as standard cell, selective emitter cell and PERC cells. The comparison of cell efficiencies showed that light doping emitter and surface passivation can improve the Voc. But the main improvement was due to the Jsc increase caused by the light reflection on the back surface of PERC cells. Besides, this study suggested two kind processes of kerf-loss less wafers and cells, including Thermal-stress Induced Pattern Transfer (TIPT) and Stress induced Lift-off Method (SLiM-cut). TIPT method deposited Si thin layer on the patterned sapphire substrate. After exfoliated the Si layer using thermal stress, the pattern on the sapphire substrate was transformed to the Si thin layer. It can be used as the honeycomb surface texture for light absorption without any mask process. SLiM-cut method can peeled off a Si thin film around 40m from a thicker substrate. After removing the metal and surface residual on the peeled silicon film, the HJT process was applied on the film to fabricate solar cells. The maximum efficiency of solar cells was up to 14.7%. This result provides a physical and experimental basis to develop non-kerf-loss thin crystalline solar cells whose performance can be further improved in the future.

並列關鍵字

Solar cell Crystalline silicon Thin wafer

參考文獻


[1] A. G. Aberle, “Fabrication and characterization of crystalline silicon thin-film materials for solar cells,” Thin Solid Films, vol.511-512, pp.26-34, 2006.
[2] I. Gordon, F. Dross, V. Depauw, A. Masolin, Y. Qiu, J. Vaes, D. Van Gestel and J. Poortmans, “Three novel ways of making thin-film crystalline-silicon layers on glass for solar cell application,” Solar Energy Materials & Solar Cells, vol.95, pp.S2-S7, 2011.
[4] Jenny Nelson, “The physics of solar cells”, Imperial College Press, 2003.
[6] G. P. Willeke, “Thin crystalline silicon solar cells,” Solar Energy Materials & Solar Cells, vol.72, pp.191-200, 2002.
[7] V. Gazuz, M. Scheffler, and R. Auer, “Thin 60m-thick crystalline silicon solar cell on ceramic substrate by Al-bonding,” IEEE 4th World Conference on Photovoltaic Energy Conversion, Waikoloa, USA, pp.976-979, May 2006.

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