先進鑽石樹脂線鋸鋸切特性與磨耗之研究

Study on the Sawing Characteristics and the Wear Behavior of Advanced Diamond Wire Saw

陳勇廷(Yong-Ting Chen)

指導教授 ： 左培倫

國立清華大學/工學院/動力機械工程學系/碩士(2006年)

https://doi.org/10.6843/NTHU.2006.00264

摘要

摘要

近十幾年來，固定磨粒線鋸切割技術之發展相當迅速，固定磨粒線鋸依使用的鑽石附著方式的不同大致可分為三種線鋸：樹脂、電鍍及硬銲線鋸。其中電鍍及硬銲不易製作成細的線鋸，為了達到窄切縫與低製造成本，發展樹脂鑽石線鋸勢必為一個重要的研究方向。
而樹脂鑽石線鋸的缺點在於鋸切加工時，鑽石磨粒較易脫落；原因在於樹脂難以將鑽石磨粒固定於線芯上。因此本研究嘗試使用先進鑽石磨粒ＡＢＣＤ（Active Braze Coating Diamond），其對樹脂結合劑有較佳的附著力，期望改善樹脂線鋸對鑽石磨粒的抓持力。鑽石在鋸切時其壽命會隨切速的增加而減低，但如果鑽石的破裂及脫落的比率可以降低，則工具的壽命或切速會相對提高。由於銅衣ＡＢＣＤ不會被撞脫落而且強度仍高，所以鋸片的壽命和切速都會同時提高。
以觀察切屑及參數控制，使先進鑽石樹脂線鋸控制在延性模式內，了解先進鑽石線鋸鋸切硬脆材料(精密陶瓷氧化鋁)之鋸切特性，以得到良好的表面粗糙度及較佳的鋸切效率為研究的目標。

關鍵字

延性磨削 ； 先進鑽石線鋸 ； 氧化鋁 ； 硬脆材料

並列摘要

Abstract

In recent years,the development of the slicing technology with Fixed Diamond Wire Saw is very fast.In order to lower the manufacturing cost of wire saw and to close the kerf loss,it is very important to develpoe the resin-bonded diamond wire saw.During the process of resin-bonded wire saw slicing,most diamond grits are knocked off ,so the resinoid diamond wire saw performs way below its potential.In order to gain fine surface quality and high accuracy in industrial requirement more efficiency,so this paper uses Advanced Diamond Wire Saw (ABCD wire saw) to slice Alumina. The advantage of using ABCD wire saw is the ABCD grain have strong retention on the resin matrix, so the Advanced Diamond Wire Saw has great tool life.Further,to analyze saw slicing properties and measure surface roughness, we use SEM to measure chip formation of ceramic materials. These methods can help us to know the brittle fracture mode and ductile regime grinding mode in ceramic materials remove modes. Finally, we control parameters to gain ductile regime grinding mode of slicing ceramic materials. These methods can slice more efficiently and improve surface roughness more excellently. Ductile regime produces thin deteriorate layer and increases requirement of industry.

並列關鍵字

Ductile Regime Grinding ； Advanced Diamond Wire Saw ； Alumina ； Bonding Strength

參考文獻

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