電路板組裝線之投料配置–以SMT生產線為例

Production Allocation for Printed Circuit Board Assembly - Surface Mount Technology Lines

鄭川文(Chuan-Wen Cheng)

指導教授 ： 許棟樑

國立清華大學/工學院/工業工程與工程管理學系/碩士(2006年)

摘要

本研究探討有關於表面黏著技術生產線之機台配置優化和電路板組裝投料的分派，本研究分為三個階段。第一階段，首先求算取置機台的需求數量，再利用變異數分析（Analysis of Variance；ANOVA）的方法去尋找出較適當的生產線配置，來讓整個組裝的生產更加的有實際效益，以避免造成過多的機台閒置浪費；第二階段，則是針對日程投料分派問題，依照多條SMT生產線的排程特性，以平行機台加工的觀念、工件可以自由分割的性質與生產線投料的限制，來構建一個整數規劃（Integer Linear Programming；ILP）的數學模式，最後階段，則以模擬（Simulation）的方式來驗證規劃後的生產線投料安排的可行性及效率。
本研究成果包括：（1）提供一個實務上機台配置優化的方法；（2）完成電路板組裝投料優化。由於（1）與（2）之整合，本研究成功地提昇了個案公司生產線效率達43.41％。

關鍵字

SMT生產線 ； 變異數分析 ； 投料分派 ； 整數規劃 ； 模擬

並列摘要

The study proposed a practical optimization method for production line configuration and continued to optimize the order release schedule for a Printed Circuit Board assembly line base on Surface Mount Technology. The research was composed of three stages. In the first stage, a strategy was proposed to determine optimal machine configuration base on predicated production needs, bottleneck machines, financial analysis, and Analysis of Variance. In the second stage, Linear Integer Programming was used to determine the order release schedule base on the selected line configuration in the first stage. In the third stage, simulation was used to compare the production efficiency with the results from proposed line configuration and order release strategy.
The result shows that the production efficiency of the combined optimized line configuration and order release performed better than the existing line configuration and order release policy by 43.41％.

並列關鍵字

SMT production line ； Analysis of Variance ； Order release schedule ； Integer Linear Programming ； Simulation

參考文獻

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