晶圓承載系統中玻璃塗佈流程之改善研究

Improvement of glass coating process in Wafer Support Systems

蔡志強

指導教授 ： 黃雪玲

國立清華大學/工學院/工業工程與工程管理學系碩士在職專班/碩士(2011年)

https://doi.org/10.6843/NTHU.2011.00175

摘要

半導體技術朝向高性能與高密度化發展要求下，半導體製程微縮已面臨成本增加與物理特性極限的挑戰，因此在效能提升與成本控制兼顧要求下，以及在財務負擔日漸沈重與物理極限逼近的多重壓力下，主要半導體製造商紛紛投入矽穿孔三維電晶體(簡稱 TSV 3DIC)技術的研發，3DIC技術是目前唯一能有效增加產品效能、減低功耗、降低成本、縮小體積及整合異質IC的未來主流技術，更被視為目前能突破摩爾定律的最佳解決方案；然而這項新的技術將引起對超薄晶片製程的需求；超薄晶片比較不穩定也容易受應力的影響，因為當晶片厚度薄到100μm以下，製程遭遇的困難就油然而生。此外晶粒也比較容易破裂或是翹曲，這不光發生在磨片的過程中，也出現在磨片後的步驟。為解決這些問題，美國3M公司發展了一套晶片承載系統(Wafer Support System, WSS)可承載晶片經過背面研磨以及其後的各項磨薄製程。
本研究以S個案公司為實際的例子，針對晶片承載系統之玻璃載具生產流程中的進檢目視站、化學洗淨站以及成品檢驗站進行改善，運用工作研究與人因工程等專業知識，對WSS之玻璃載具塗佈生產流程進行一系列的資料收集，對人為因素與檢驗治具所造成的失誤以及生產過程中對於危害人體的工作環境提出改善方案；並且針對不適當的量測治具對玻璃的品質所造成的影響進行改善，進而降低玻璃載具之生產成本，並對有缺失的作業環境及製程進行改善
經由人因工程的觀點與工作研究的手法改善現場作業與作業環境後，結果顯示進檢目視站、化學洗淨站以及成品檢驗站的不良率降低，並且提高了生產效率，有效地減少人為疏失的次數，達到減少重工、退件、客戶抱怨等的研究目的，並使工作環境上有較為舒適的工作環境，使公司競爭力能更為提升。

關鍵字

矽穿孔三維電晶體、晶圓承載系統、危害因子、人因工程、工作研究、目視檢驗

並列摘要

Semiconductor has faced the utmost challenge of cost increase and physical properties at the request of high functions and high density development. In addition to the difficulties of research and development and the milestone increase, the expanse on process development, IC circuit design and equipment capital expend largely. For the reasons above, manufactures and IC maker cannot afford it. To meet the needs of effectiveness and cost control, main semiconductor manufactures make efforts in TSV 3D IC technology. The 3DIC is the main stream technology to increase capacity utilization, decrease power loss, reduce bulk and integrate different kinds of IC. This new technique will bring about the demand to ultra-thin chip. The chip is thinner than 100μm and the difficulties exist. Furthermore, the grain is easily fractured and warped. This condition takes place not only the process of micro section but also after micro section. For the sake of the reasons, 3M Company develops Wafer Support System to carry chips grinded and the procedure of thin film. The purpose of this study is to improve the workstation of glass carrier production process flow. This research takes S Company as an instance. These study combine human ergonomics and work study concept to improve the design of workstation. It focuses on the improvement of glass carrier of Wafer support system process flow through visual inspection, chemical cleaning and final inspection station. Apply the human ergonomics concept and work study point for workstation improvement with the hazard factors against work、human errors and production fail rate. Improving workshop by considering human ergonomics and work study, this study conducts that the drop of defect rate in visual inspection station, chemical cleaning station and final inspection station increases productivity. Moreover, the result indicates that it can reach effective reductions of artificial mistakes and reworking, the return of goods and customers complain. This study also centers on bettering the flaw of production process and reducing the hazard factors against work. Only the continuous improvement as well as providing good quality, low price and early delivery products could stand out from the crowd. Therefore, make case company glass carrier manufacture more competitive via no harmful working environment and increasing working effectiveness. Keywords: Through Silicon Via 3-Dimension、Wafer Support System、Human ergonomics、 Work Study、Hazard factor、Visual inspection

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