積體電路封裝外包管理:以整合元件製造商為例

The Outsourcing Management of IC Package Assembly – A Case of An IDM

巫浩原(Hao-Yuan Wu)

指導教授 ： 朱詣尹

國立清華大學/工學院/工業工程與工程管理學系碩士在職專班/碩士(2008年)

https://doi.org/10.6843/NTHU.2008.00409

摘要

整合元件製造商（IDM）因有台灣特殊專業垂直分工的發展優勢，在規模與資源劣勢下，能夠善用其本身的核心競爭力，將其非核心的業務透過製造外包活動，尤其是積體電路產業裡勞力相對密集的積體電路封裝製程，透過適合的封裝廠，整合外在的製造資源，來提升企業的整體競爭優勢。
本研究以某整合元件製造商的積體電路封裝外包管理為分析案例探討經由封裝外包管理取得即時而充足封裝產能的應有作為及與IC封裝廠在產能及備料上增進信任的合作模式。
本文提出之封裝外包管理流程及執行要項在作業層面上有效改善了來自個案公司內部的生產管理問題及封裝廠內部的管理問題。而個案公司給封裝廠訂單資訊內容不正確或不充足的問題也因個案公司從晶圓製造到成品測試的生產資訊重新串連後獲得改善。本文亦提出增進IDM公司及封裝廠間信任關係的互動模式，可以有效促進雙方的合作關係。
就作業層面而言，此封裝外包管理模式亦適用於IC設計公司。但是IDM公司在必須管理晶圓廠、晶圓測試廠甚至是成品測試廠的背景條件下，其整體人力配置及工程團隊技術能力皆有助於在封裝外包管理上更深入的參與。

關鍵字

整合元件製造商 ； 外包管理 ； 積體電路封裝

並列摘要

Integrated Device Manufacturers (IDM) can focus on their core technologies and raise their competitiveness with outsourcing non-core technology operations, taking advantage of the specialized capabilities in the IC industry supply chain in Taiwan. The key is for the IDM to integrate the resources of subcontractors into its manufacture operations to enhance its competitive ability. For example, IDM needs the assistance of the contract assembly house to cover their package assembly process.
This study explores the management practices of the assembly capacity outsourcing with a selected IDM case in Taiwan. The key questions are: how an IDM acts to get enough capacity and timely response from the assembly house, and how IDM and the assembly house reach the agreements on capacity and material preparation.
This study works out a suggested process flow of the assembly outsourcing management and the related execution actions. The process flow is derived from the case study and is shown to solve the production control problems in the selected IDM and its assembly house. After the IDM adopted the process flow to links the production data from wafer manufacture to the finial test as an integrated process, these control problems are solved and the performance improved. This study has also based on the suggested process flow built a model to improve the trust in the relationship between the IDM and the assembly house.

並列關鍵字

Outsourcing Management ； IC Package Assembly ； Integrated Device Manufacturers (IDM)

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