本研究乃在合成熱固性樹脂並對其作性質之研究,主要分成兩部分。第一部份是在合成出一新型馬來醯胺-環氧樹脂單體,即MIE,並對其馬來醯胺-環氧樹脂單體加入不同硬化劑來作硬化後樹脂的性質研究;以傅利葉轉換紅外線光譜儀( 即FT-IR )去鑑定其結構,並以示差掃瞄卡計儀( 即DSC )及熱重量分析儀( 即TGA )作熱性質的分析。由示差掃瞄卡計儀我們可以發現:熱固性樹脂之玻璃轉移溫度有200℃以上。由熱重量分析儀在氮氣之下之下,我們發現熱固性樹脂之裂解溫度( Td-5% )有354℃以上,在700℃時焦炭的殘餘量也有48%以上;而在空氣之下之熱固性樹脂之裂解溫度( Td-5% ) 亦達有第二部分則是以馬來醯胺-環氧樹脂單體與四種不同雙酚單體反應合成出雙馬來醯胺單體,即BMI。針對加工處理上之溶解度與可加工視窗作探討,並對加入硬化劑與否來作硬化後樹脂的性質研究。以傅利葉轉換紅外線光譜儀( 即FT-IR )去鑑定其結構,並以示差掃瞄卡計儀( 即DSC )及熱重量分析儀( 即TGA )作熱性質的分析。我們可以發現雙馬來醯胺單體可溶在極性溶劑中且加工視窗也達到50℃以上。由示差掃瞄卡計儀:其熱固性樹脂之玻璃轉移溫度均有190℃以上;由熱重量分析儀在氮氣之下其裂解溫度( Td-5% )仍達280℃以上,且在700℃時的焦炭殘餘量亦達40%以上;而在空氣之下其裂解溫度( Td-5% )仍達260℃以上。故馬來醯胺-環氧樹脂與雙馬來醯胺樹脂之熱穩定性相當良好,在應用上亦更加廣泛。
英文摘要 A novel compound (4-maleimidophenylglycidylether, MIE) containing both maleimido and epoxide groups was synthesized as use as monomers for preparation of new thermosetting resins. The chemical structure of MIE was characterized with FTIR and 1H NMR. Thermosetting resins showing high glass transition temperatures (>210 ℃), good thermal stability (higher than 350 ℃), and excellent flame retardance (LOI = 38) were obtained from curing MIE with conventional epoxy curing agents of DDM and DICY. The kinetics of the curing reactions was also studied. Reacting MIE with various biphenol compounds gave a convenient approach to prepare bismaleimide compounds having epoxy linkages between the maleimide groups. These bismaleimides exhibited good organosolubility, low melting points, and wide processing windows, consequently referred their good processibility. It was found that incorporating silicon group into the bismaleimide resulted in superior thermal stability of the cured bismaleimides.
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