覆晶封裝之Herschle與Carreau的黏度參數之轉換與擬合

The Transformation and Curve Fitting of Viscosity Parameters Models in Flip Chip Package of Herschle and Carreau

吳佩恭(Pei-Kung Wu)

指導教授 ： 鍾文仁

中原大學/工學院/機械工程研究所/碩士(2003年)

https://doi.org/10.6840/cycu200300762

摘要

摘要
覆晶(FC)封裝可利用CAE分析軟體模擬塑流流動的情況及預測可能產生的缺陷；其分析結果有助於製程缺陷的改善與良率的提升。面對時常因應需求而以不同軟體來作分析，如何將所使用公式與參數經由轉換與擬合，來驗證其結果是否相互吻合，卻是件煩人的問題。因此，本文將著重於探討同一覆晶封裝充填材料，以MOLD-FLOW與FLOW-3D兩種軟體作模流分析時，兩者黏度公式的參數轉換與擬合。
本論文首先討論兩軟體黏度公式的理論與參數關係，以及充填材料HYSOL FP4511在MOLD-FLOW黏度公式中的參數值與分析條件，再利用MATLAB 中的Curve Fitting Toolbox之擬合功能，將前者所得數據與FLOW-3D黏度公式的參數作轉換及擬合，最後求得一組擬合最佳化參數，與FLOW-3D最佳化黏度公式：
此組公式，可作為同一材料以MOLD-FLOW轉換成FLOW-3D作模流分析時，驗證結果的一個的使用公式。

關鍵字

覆晶封裝 ； CAE分析 ； 模流分析

並列摘要

ABSTRACT
Flip-Chip package can use CAE analytic software to simulate the condition of flowing patterns and to predict possible defects. The consequence of the analysis is helpful for improving the defects those are produced during the manufacturing process and for promoting the goodness of products.
In order to meet varied needs, we have to do analysis by using different software. However, it is a troubling problem that how we can prove the result by transferring and fitting the formulas and parameters those we use. Therefore, this study will emphasize on the parameters’ transferring and fitting of the viscosity formulas when we use MOLD-FLOW and FLOW-3D to do molding analysis on the same materials of underfill.
First of all, we are going to discuss the relationships of the theories and parameters between MOLD-FLOW and FLOW-3D, and the parameter values and the analytic terms of the materials of underfill, HYSOL FP4511 in MOLD-FLOW viscosity formula. Then, transferring and fitting the data those we gain form the Curve Fitting Toolbox’s fitting function of MATLAB and the parameters of FLOE-3D viscosity formula. Finally, we will have a set of nonformula FLOW-3D viscous Wire bonding technology as is the most common bst superior fitting parameter and a most viscous elastic formula of FLOW-3D.
This set of formula can be used in testing the consequences of the molding analysis while the same material which is transferred from MOLD-FLOW to FLOW-3D.

並列關鍵字

flowing pa ； CAE analytic ； MOLD-FLOW ； Flip-Chip ； FLOW-3D

參考文獻

[8]Y. R. Chen,“Mold-Flow Simulation and Wire Sweep in IC Encapsulation”, Mater Thesis, Chung Yuan Christian University, July 2001.

[5]張千惠,“Mold-Flow Analysis of High-Density IC Encapsulation”,Chung Yuan Christian University ,July 2002.

[3]S. Han and K. K. Wang,“Analysis of the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips”, IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B, Vol. 20, No. 4, pp.424-433, Nov. 1997.

參考文獻

[1]模具技術成果暨論文集,“Molding Analysis and Structural Analysis of BGA, 張明倫、陳佑任、洪勝川, 中原大學機械系, 爐俊榮、李榮裕, 工業技術研究院機械工業研究所, 吳英政, 上寶半導體, 1999.