陶瓷燈具內高功率LED散熱基板形狀之熱傳分析

A Thermal Analysis of Substrate to High Power LED in a Ceramic Lamp

陳漢和(Han-Ho Chen)

指導教授 ： 許政行

中原大學/工學院/機械工程研究所/碩士(2009年)

https://doi.org/10.6840/cycu200901187

摘要

本文之研究是利用數值模擬分析軟體以及實驗，利用分析模擬軟體針對陶瓷燈具內LED晶片與陶瓷燈具間之散熱基板幾何形狀進行熱傳影響分析。在數值分析前先進行基礎量測，並且利用手冊建立所有的設定數值標準，並依此標準套入CFD軟體。利用此數值方法所求得之模擬誤差值約在3.9 %之內。
本文之研究結果顯示，散熱基板之幾何對於本文所使用之陶瓷燈具具有影響，接面溫度（Tj）的上升與散熱基板的面積增加以及基板的厚度與材質熱傳係數的上升有關。然而更換更高之材料係數對於溫度的下降並不明顯，其可能之原因在於陶瓷之材料熱阻所造成之現象。本文分析之結果可以作為以後相關產品設計的參考依據。

關鍵字

接面溫度 ； 散熱基板 ； LED燈具 ； CFD軟體

並列摘要

In this study, the thermal phenomena of a LED ceramic lamp was studied by a CFD software package (ICEPAK®) and experiments. The thermal performance was simulated by the CFD software for the various substrate geometry between the LED module and the ceramic lamp. All the properties and parameters used in the computational simulation were determined by experiments and handbooks. The simulated results agreed well with the measured data and the deviations between simulations and measurements are within 3.9 %.
The junction temperature (Tj) of the LED lamp is related directed to the substrate geometry. The junction temperature decreases when the area of the spreader, the thickness or the thermal conductivity of the substrate increases. However, using a substrate with a higher thermal conductivity doesn’t make a significant temperature decrease due to the present of the thermal resistance of ceramic material of the lamp. The results of this study can be used as the reference for the commercial design of the LED ceramic lamp.

並列關鍵字

LED Lamp ； CFD ； Substrate ； Junction Temperature(Tj)

參考文獻

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