摘要 對於半導體製造測試的產品競爭力而言,良率無疑是最重要的因素。然而,有效提昇測試機台之使用率與降低機台誤判(overkill)測試,無疑是一大提昇競爭力方法之一。周秀玉(2009)晶圓測試是利用測試機台與針測卡(Probe Card)來測試晶圓上每一顆晶粒(die),以確保晶粒的電性效能是依照設計規格的要求,其測試機台可以搭配裝有金屬製成細如毛髮的探針卡,透過探針來偵測與晶片上的焊墊(Pad)或錫球(Bump)接觸,以便直接對晶片輸入電壓、電流並判別輸出值。然而晶粒良品與不良品,往往皆由機台的時域反射TDR (Time-Domain Refection)的成功與失敗有著相當大的影響。也因此為提高測試產品的良率為其目的,針對J750機台因TDR造成良率下降的問題,透過福特8D手法可以發現對產品的良率有其改善效果。本研究運用福特8D的改善程序,搭配SWOT分析、品管手法以及 PDCA 分析法,成功的降低個案公司測試機台因TDR造成誤判良率發生由27小時降到7.9小時,平均改善70.52%,其改善成果能反應顧客的需求與期望。
Abstract For semiconductor manufacturing competitive products, the yield is undoubtedly the most important factor. However, effectively improve the utilization rate of the test machine with lower machine mistakenly killed (overkill) test, is undoubtedly one of the competitive approach a big improvement. Wafer test using the test machine and probe card (Probe Card) to test each one grain (die) on the wafer to ensure electrical performance is in accordance with the design specifications grain requirements, the test machine can equipped with hair-thin metal probe card, through a probe to detect the pad (Pad) and the ball (Bump) contacting the wafer directly to the input voltage, output current and the determination. However, grain yield and defective products, often chosen by the machine time zone reflection TDR (Time-Domain Refection) success and failure has considerable influence. Therefore for the purpose of improving the yield of the product, this method can be found in the product with its effect of improving the yield。In this study, Ford 8D improvement program, with a SWOT analysis, quality control methods and PDCA analysis, the success of the company to reduce cases of TDR test machine due to mistakenly yield generated by the 27 hours to 7.9 hours average improved 70.52%. Improving outcomes can respond to customer needs and expectations。