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  • 學位論文

建構整合性問題解決模式-I8D

Construction of Integrated Problem Solving Model-I8D

指導教授 : 江瑞清

摘要


本研究提出「整合性問題解決模式-I8D」,主要整合QC Story、精實生產、六標準差及8D的改善步驟與手法,並運用TRIZ系統化創新方法之發明工具,建構快速解決問題且有價值的問題解決模式。案例驗證中,以某半導體製造公司為個案驗證,改良原有8D改善流程並期望提升三維系統單晶片製程良率,透過I8D改善流程,將原有複雜流程簡化,增強原有改善活動之不足,證實I8D可行性並補強問題解決方法之不足。

並列摘要


This paper attempted to establish an “Integrated Problem Solving Model,” which is named “Integrated 8 Disciplines-I8D.” This model combined improvement steps and techniques including QC Story, Lean, Six-sigma and 8D. In addition, this system applied TRIZ (Theory of Inventive Problem Solving) tools to construct a quick and valuable problem solving model. By adopting I8D to the semiconductor manufacturing company as case study, the result indicated the yield rate of 3D IC, and modified the original 8D processes. To conclude, this paper proved that integrated model could bring benefits to the case study, by employing this model’s feasibility to reform its weaknesses and to upgrade its strengths.

並列關鍵字

3D IC Integrated Problem Solving Model I8D

參考文獻


沈政諭,2006,“精實生產與六標準差整合模式之研究-以光電零組件偏光板為例”,中原大學工業與系統工程研究所,碩士論文。
吳政諭,2006,“應用精實六標準差改善流程週期效率”,清華大學工業工程與工程管理研究所,碩士論文。
林松茂,2008,“8D(Disciplines)多問5WHY來採取矯正預防改善對策”,品質月刊,第四十四卷,第五期,頁65-69。
葉忠、施明欣、童世豪、楊喻萍,2005,“8D改善的程序與運用--以半導體封裝為例”,品質月刊,頁42-51。
黃心怡,2008,“精實六標準差應用於印刷電路板防焊製程之流程改善研究”,中原大學工業與系統工程研究所,碩士論文。

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