厚膜光阻製程應用於靜電式微夾持器之研製

Fabrication of the electrostatic microgripper by thick photoresist process

王服賢(Fu-Hsien Wang)

指導教授 ： 楊啟榮 ； 程金保

國立臺灣師範大學/科技學院/工業教育學系/碩士(2004年)

摘要

SU-8厚膜光阻具有優異的機械與化學性質，且使用一般的UV微影製程，即可達到高深寬比的微結構。現今SU-8光阻已應用於LIGA電鑄製程之模版、熱壓成形之模仁、微光合成形、光波導、微流體應用流道或微機械結構等之材料，在直接將SU-8光阻作為微致動器主體結構材料的研究並不多見。本研究目的即是結合低成本的SU-8厚膜光阻製程與釋放(ICP-RIE、光阻犧牲層)技術，製作一體成型的靜電式微夾持器；期望能達到大位移、反應快、操控簡單及應用廣泛之精密微夾持器。另外，並結合電鑄技術製作全金屬的微夾持器結構，藉以探討不同材料對於微夾持器的電性與動態特性差異。在研究中，成功利用ICP-RIE釋放技術，製作出微夾持器，並以起始電壓19.2 V驅動夾爪成功，且於電壓100 V時，即達到最大的夾持量400 mm。而光阻犧牲層釋放技術，一直受限於液體表面張力的影響，未能成功地釋放夾爪結構。此外，全金屬結構製程，雖然成功地製作，但受限於金屬結構本身太過剛硬，使得在電壓190 V時仍然無法作動。

關鍵字

SU-8厚膜光阻 ； 釋放技術 ； 電鑄技術 ； 靜電式微夾持器

並列摘要

The SU-8 thick photoresist is well known for its mechanical and chemical property and it can be used to easily achieve high aspect ratio microstructures with a traditional UV photolithography. Nowadays, the SU-8 photoresist has been applied to different areas such as serving as the base for LIGA electroforming process of mold, as the mold of hot embossing, and also as the material for microstereolithography, optical waveguides, microchannels or some microstructures. However, little research has been carried on using SU-8 as a material for the main structure of micro-actuator. This research is to combine low-cost SU-8 and ICP-RIE technique to build a unitary electrostatic microgripper. This microgripper is expected to have maximum displacement, fast reflection, and is also easily controlled and can be widely applied. Furthermore, we are also interested in discussing the effect of different material on microgripper’s different performance in the electric and dynamic properties so we also built up all-metal microgripper by using electroforming. We have successfully constructed micro-gripper with ICP-RIE technique and were activated to perform gripping function successfully at 19.2 initial voltage. The maximum displacement (400um) was achieved by applying 100V voltage. However, we are not able to release the structure in the photoresist sacrificial layer releasing technique due to the surface tension of the liquid being used. Moreover, we had successfully constructed a microgripper with all-metal technique but due to the strength of metal structure, it cannot actuate even by applying 190V voltage.

並列關鍵字

SU-8 thick photoresist ； release technique ； electroforming technique ； electrostatic microgripper