銅箔基板鑽孔最佳化參數設計

Design of the Optimization Parameters for Drilling of Copper Clad Laminate

張立衡(Li-Heng Chang)

指導教授 ： 謝傑任

國立虎尾科技大學/工程學院/機械與機電工程研究所/碩士(2013年)

摘要

印刷電路板產業是台灣電子零組件的三大產業之一，也是少數根留台灣的製造業，面對全球化的激烈競爭，提升品質、良率、降低成本、提升企業競爭力，是台灣電路板產業期待發展的方向。
　　本文是以電路板中的銅箔基板（Copper Clad Laminate, CCL）做為研究對象，探討電路板製程中，鑽孔加工的參數組合，求得最佳鑽孔品質。
為了避免實驗設備的製程能力不足而影響結果的準確度，在實驗前先進行鑽把機的穩定度測試，確保製程的穩定性，同時為了檢驗量測系統是否有足夠的能力解讀實驗數據，在實驗前進行量測系統分析(Measurment System Anaylsis.MSA)確保量測系統準確無誤。
　　實驗以反應曲面法(Response surface methodology, RSM) 搭配中央和成設計進行設計實驗規劃，以鑽頭轉速(Rotation Speed)、進給速度(Feed Rate)作為製程因子，探討鑽孔品質的孔間(Hole Distance)、直徑(Diameter)、真圓度(Roundness)等參數與鑽軸使用壽命的關係。並藉由統計學中的迴歸分析、變異數分析等分析手法，排除不適當的製程因子並找出迴歸方程式，之後藉由模型適當性檢驗確定實驗的合理性，確保實驗數據正確。然後藉由推導出的迴歸方程式預測鑽孔最佳化參數組合，最後再將得到的製程參數進行鑽孔，並將結果進行驗證，確保準確性。

關鍵字

反應曲面法 ； 銅箔基板 ； 鑽孔 ； 最佳化

並列摘要

The PCB industry is three largest among Taiwan’s electronic components industries and one of the few electronic industries that has largely remained in Taiwan. Confronting globalization competition, product quality improvement, cost reduction, enhancement corporate competitiveness is the direction of PCB industry in Taiwan.
　　Therefore, this paper employs relevant theory of statistical techniques to discuss the influence of individual process parameters of drilling experiment and the forecast of optimum process parameters. It utilized the Response Surface Methodology (RSM), selected the rotation speed of drill and feed rate as process factors, and discussed the relationship between diameter, roundness and process factors. RSM verified the factors of output quality characteristics by Analysis of Variance (ANOVA). The response surface equation was deduced by Regression Analysis, and the optimum process parameter combination and result were forecasted through expectation function.

並列關鍵字

CCL ； Drilling ； Optimization ； RSM

參考文獻

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