1976年政府引進半導體相關技術,迄今已滿40年週年,國內的半導體產業,不論是IC設計、晶圓代工、IC測試、IC封裝等,在世界的半導體產業上占有一席之地。另外,半導體產業至今仍然屹立不搖,主要因素為半導體所做出的IC、電晶體或其他元件,在電子產品是無法或缺的元件,而在生活中更邁入生活智慧化,也代表半導體產業的需求仍持續成長。但近幾年中國在半導體市場和技術的崛起及國際間的半導體產業時常有大型合併案或結盟的風潮,使得台灣各家半導體廠商面臨更嚴峻的挑戰。 在面臨嚴峻的挑戰下,以至於需要各項IC製程有更高的可靠度(Reliability),而產品在製程的情況下所產生的失效模式不斷重複發生,因此本文針對IC封裝產業的挑揀製程做為研究對象,目標為預防挑揀製程的潛在失效,目的為減少產品異常發生。為了彙整出潛在失效,所以導入可靠度相關工具包括可靠度方塊圖、故障樹分析法(FTA)、失效模式與效益分析(FMEA)。利用可靠度方塊圖做為分析機台原件的架構,並收集人員在機台上執行項目,彙整後尋找最不想發生(Top event)的失效模式,並分析出故障樹,後續運用FMEA彙整出RPN(Risk Priority Numbers,風險優先級數),並依照RPN的高低執行改善,而執行改善後的挑揀製程確實也有達成良好的效果,另外利用這次寶貴的經驗轉移到其他製程使用,以達到所有製程能有較佳的可靠度。
Taiwan’s semiconductor industry such as IC design, wafer foundry, IC testing and IC packaging has played a major role in the semiconductor industry worldwide. In addition, the semiconductor industry will continue to grow due to the increasing demand on smart devices. But the quick development of technology leads China to the semiconductor market and the international semiconductor industry often have a large merger or alliance in recent years, making Taiwan's semiconductor manufacturers face more severe challenges. Under the severe challenges, the process manufacturing IC required higher reliability; however, failure mode has been found repeatedly in the process. Therefore, this study aims to investigate the pick and place process in the IC packaging industry to prevent the potential failure in the process and reduce product abnormalities. Reliability-related tools including reliability block diagram, fault tree analysis (FTA), failure mode and effects analysis (FMEA) are used in this study to determine the most important failure modes to be improved. It is found that the picking process has better performance after improvement implementation.