透過您的圖書館登入
IP:3.142.12.240
  • 學位論文

添加有機物對無電鍍鎳層之影響

Effect of Organics on the Electroless Nickel Deposition

指導教授 : 謝淑惠
若您是本文的作者,可授權文章由華藝線上圖書館中協助推廣。

摘要


本研究探討添加有機物和不同基材對無電鍍鎳金屬薄膜之影響。藉由添加不同濃度的有機物如乙醇、檸檬酸和葡萄糖等添加物,利用掃描式電子顯微鏡(SEM)觀察無電鍍法沉積鎳金屬於矽晶片及玻璃上其表面和剖面微觀結構,以及使用能量散射X光譜儀(EDS)分析成分、X光繞射儀分析熱處理前後相變化,以瞭解基材結晶性以及對環境友善之有機物對無電鍍鎳金屬晶粒析出、微結構和成長等之影響。 實驗結果顯示:在pH為5.0的酸型鍍浴中添加葡萄糖,可以在矽基材和玻璃基材上得到較光滑無電鍍鎳鍍膜,而鍍液中添加葡萄糖和檸檬酸可使無電鍍鎳鍍膜表面更光滑,尤其是加入葡萄糖時,在玻璃基材上和玻璃基材上鍍鎳時,鍍液最佳濃度分別為添加20g/l葡萄糖和添加30g/l葡萄糖。 在玻璃基材上成長,鍍液pH為5.0,並添加葡萄糖30g/l的無電鍍鎳-磷的活化能為19.0 kcal/mol。 鍍液中添加葡萄糖20g/l在矽基材上無電鍍鎳-磷鍍膜,是非晶質結構的,經400℃真空退火1小時後,出現Ni3P的相,鍍液中添加葡萄糖30g/l在玻璃基材上無電鍍鎳-磷鍍膜,亦是非晶質,經400℃真空退火1小時後,出現Ni3P, Ni 和 P相。

並列摘要


In this study, the effect of adding organics in plating bath and various substrate on the electroless Nickel films was investigated. The experimental parameters contained pH, various concentration of organics including ethanol, citric acid, substrate including glass plate and Si wafer, and annealing. The experiments were carried out repeatedly and an X-ray diffractometer (XRD) and Field Emission Scanning Electron Microscope (FE-SEM) with Energy Dispersive Spectroscopy were used to observe the phases, microstructure and chemical content. The results show that adding glucose in pH 5 electroless Nickel plating bath could smooth the surface of electroless Nickel film on glass and Si substrates. Adding glucose and citric acid in plating bath could enhance the smooth of electroless Nickel surface, especially adding glucose, the optimum concentration was used on Si substrate and on glass substrate is 20 g/l glucose and 30 g/l glucose, separately. The activation energy of the electroless Ni–P deposition on glass at pH 5.0 of the plating bath and adding 30 g/l glucose in the plating bath is 19.0 kcal/mol. The P content of electroless Nickel film increased after deposited in adding glucose. The as-plated Ni-P films on Si substrate are amorphous, after annealing at 400℃ for one 1 hour, the Ni3P phases appeared. The as-plated Ni-P films on glass substrate are amorphous, after adding 30 g/l glucose in plating bath and annealing at 400℃ for one 1 hour, the Ni3P, Ni and P phases appeared.

參考文獻


[9] T. S. N. Sankara Narayanan, S. Selvakumar, and A. Stephen, “Eiectro-lessNi-Co-P ternary alloy deposits:preparation and characteristics”, Surface and Coatings Technology, Vol.172, pp.298-307.
[13] Liu W.L., S.H.Hsieh, T.K.Tsai, and W.J.Chen, “Growth Kinetics of ElectrolessCobolt Deposition by TEM”, Journal of the Electrochemical Society, Vol.151, 2004, pp.680-683
[21] Y. Liu, Q. Zhao, 2004, “Study of electroless Ni-Cu-P coatings and their
[22] B. Singh, and R. Mitra, J.Electrochem.Soc., 127, 1980, P2578.
[25] X. Haowen, and Z. Bangwei, J.Mater.Pro.Techno., 124, 2002, P8.

延伸閱讀