反射式雙向角度偏向三維顯微鏡及其影像誤差之研究

Study On Image Errors Of Reflection-type Biaxial Angle-Deviation Three-dimensional(3-D) Microscope

李及元(Ji-Yuan Li)

指導教授 ： 邱銘宏

國立虎尾科技大學/電機資訊學院/光電與材料科技研究所/碩士(2014年)

https://doi.org/10.6827/NFU.2014.00252

摘要

本研究提出一種非掃描非接觸非干涉的反射式雙軸角度偏向三維顯微鏡。當一經擴束後之平行光投射在待測物上後表面上的高度落差會造成反射光角度的變化，再經由平行四邊形稜鏡將此角度改變轉換成靈敏的出射光強度變化。因考慮待測物反射光在x、y方向的角度偏向角對量測高度的影響，在不增加稜鏡的情況下，利用旋轉待測物90˚方式前後拍攝，以得到二軸方向之角度偏向角所獲得之二高度，再取均方根值，可使高度誤差值降至最低，進而的得到較真實的三維影像，並對影響架構之景深及焦深進行研究，得到誤差比為2.62%，然後對於實驗可靠性進行分析，使用多次量測求得標準差為2.1nm。
此反射式雙軸角度偏向三維顯微鏡，其放大倍率可達到一百五十倍以上，可提供次微米的量測，利用此架構可迅速得到二維表面輪廓，若結合CCD光強度影像分析其折射率，即可轉成三維表面影像，由於CCD擷取影像快速，可做大面積的快速量測、耗時少等優點。

關鍵字

CCD ； 臨界角 ； 顯微鏡 ； 三維形貌 ； 影像誤差

並列摘要

In this study, we proposed a non-scanning, non-interferometric, non-contact, reflection-type biaxial angular deviation (3-D) three-dimensional microscope. When a laser beam reflected from a transparent specimen, the surface height will change the beam direction causes its reflection ray deflect a slight angle. Afterward all the rays from the test surface are incident into a parallelogram prism at the critical angle nearby and cause the output intensity be changed. Because the reflectance of the prism curve versus the incident angle is nonlinear, the nonlinear-error compensation is needed to do in order to reduce the error and to enhance the measurement accuracy. In order to compare with the measurement errors between the results induced from biaxial angle deviations, two images taken before and after the rotation 90˚for analyzing the measurement results is necessary. Thus, each point information will rather real. CCD and sepecimen move forward and backward to obtain the depth of focus and depth of field, respectively. The errors due to the displacements can also be obtained. The maximum error due to the displacements is 2.62%. The experimental reliability analysis using multiple measurements show that its standard deviation is 2.1nm.
The 3-D microscope provides a sub-micron measuring range with nanometer resolution in the axial direction and can also be used to measure roughness, film thickness or surface defects in real time. The two & three dimensional images are directly captured by CCDs. Furthermore, the reflectance of each point on the surface image reveals the third dimensional information. It has merits, such as, simple structure, fast and easy operation, large area test at one shot.

並列關鍵字

CCD ； critical angle ； microscope ； three-dimension ； image error

參考文獻

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1. US patents US3013467 A