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  • 學位論文

利用資料包絡分析法(DEA)於電子零組件產業之經營績效評估

指導教授 : 何應欽
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摘要


電子產品是我們國家的主力發展項目,電子連接器產業在電子類產品扮演著「連接」的功能。電子連接器產業受到中國大陸低價競爭的影響,產業面臨經營的困難,其利潤正一點一滴的在減少,同樣的也使得部分企業因不堪長期虧損而倒閉,為使此產業能提高經營效率,本研究期望藉由資料包絡分析法(Data Envelopment Analysis, DEA)評估各家的經營績效,從中尋找此產業經營績效好的企業,以作為其他公司的學習、參考資訊。 本文應用資料包絡分析法評估台灣上市之電子零組件產業-電子連接器類之經營績效。利用資料包絡分析法中的CCR模式與BCC模式求取決策單位之相對效率。更進一步分析整體效率、技術效率、規模效率分析以及差額變數分析和參考群體等分析方法,進行實證研究。

並列摘要


Electronic products are the main developments in Taiwan. Electronic connector products in the electronics industry plays a "connection" function. Electronic connector industry affected by price competition in China. Electronic connector industry is facing operational difficulties, which are a little bit of profit reduction. The same also makes some companies have closed down due to bear the long-term losses. In order for the electronic connector industry to improve business efficiency. This study expected by Data Envelopment Analysis (Data Envelopment Analysis, DEA) to assess the performance of each business and find the good operating performance of industrial enterprises, as other companies learn, reference objects. In this paper, Data Envelopment Analysis to assess the listing of Taiwan electronic components industry - operating performance of electronic connectors class. Use Data Envelopment Analysis of CCR model and BCC mode of obtaining the relative efficiency of decision making units. Further analysis of the overall efficiency, technical efficiency, scale efficiency analysis and ANCOVA analysis of variance and reference groups, etc., empirical research.

參考文獻


10. 高強、黃旭男、Toshiyuki 、Sueyoshi(2003)管理績效評估─資料包絡分析法,台北;華泰文化事業股份有限公司。
7. 洪海玲(2002),「以資料包絡分析法作製造業之營運效率分析」,國立成功大學工業管理科學系研究所碩士論文。
22. 台灣經濟研究院產經資料庫(2014),http://tie.tier.org.tw
1. Ali, A. and Seiford, L.M. (1990) Translation Invariance in Data Envelopment Analysis, Operations Research Letters, Vol. 9, pp. 403-405.
2. Banker, R. D., Charnes, A., and Cooper, W. W. (1984), “Some Modules for Estimating Technical and Scale Inefficiencies in Data Envelopment Analysis”, Management Science, Vol. 30, pp. 1078-1092

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