軟性電子阻水氣膜之有機層組成研究

Research of organic layer compositions of water vapor barrier film for flexible electronics

陳信元(Hsin-yuan Chen)

指導教授 ： 李正中 ； 郭倩丞

國立中央大學/理學院/光電科學與工程學系/碩士(2015年)

摘要

摘 要

本文係以無機層與有機層堆疊方式進行阻水氣膜之研究，其中無機層材料選擇氧化矽(SiOx)，以全氫聚矽氮烷(PHPS)做為其前驅物，於低溫下進行濕氣反應製備而成；有機層以聚氨酯丙烯酸酯、環氧丙烯酸酯…等不同種類之光固化寡聚物樹脂配方，結合小分子之丙烯酸酯單體，作為有機層與無機層材料間之交聯劑製備而成，文中探討不同之有機層組成對於無機層之密著性、可撓曲性、耐熱性、耐水解性之影響。
實驗結果顯示，以聚氨酯丙烯酸酯為主成分，結合環氧丙烯酸酯，並以PETA(Pentaerythritol triacrylate)作為交聯劑，以UV方式固化而成之共聚物具有極佳的可撓曲性、耐熱性、耐水解性，並且因有機層組成中-OH官能基之存在，因此展現與PET基材及無機氧化矽層(SiOx)之間良好的層間密著性，單層有機-無機堆疊阻水氣膜之可見光穿透率可達90%以上，表面粗糙度Ra為0.38nm、Rq為0.57nm，阻水氣膜之水氣透過率可達0.55 g/ m2•day以下，經1000回耐撓曲測試後，仍可維持水氣透過率達0.60 g/ m2•day以下。
吾人相信以本研究之有機層材料及無機層材料，利用多層堆疊方式將可製備符合可撓式電子產品對於阻水氣膜之規格要求，在不久的未來可作為可撓式電子封裝膜材料之使用。

關鍵字

阻水氣膜 ； 全氫聚矽氮烷

並列摘要

Abstract

In this study, water vapor barrier film was prepared by stacking organic layer and inorganic layer respectively on PET substrate. Perhydropolysilazane(PHPS) was the precursor which goes moisture-curing reaction at low temperature to form silica oxide (SiOx), the inorganic layer. Polyurethane acrylate and epoxy acrylate were UV oligomers which combine with cross-linking monomer to formulate UV-curing resin, the organic layer. This study focus on the composition of organic layer affects the adhesion property, flexibility, thermal resistance and durability of water vapor barrier film.
From the experiment results, the UV-curing organic layer formulated by polyurethane acrylate oligomer, epoxy acrylate oligomer, and pentaerythritol triacrylate (PETA) monomer performs excellent flexibility, thermal resistance and durability. And the organic layer shows very good adhesion property between PET substrate and silica oxide inorganic layer because of containing hydroxyl group. The transmittance of visible light of this organic and inorganic stacked monolayer barrier film is more than 90%. The surface roughness Ra is 0.38 nm and Rq is 0.57 nm. WVTR of this monolayer barrier film is below than 0.55 g/m2•day. Even after 1000 times bending test, WVTR is still below than 0.6 g/ m2•day.
It is believed that by preparing organic and inorganic layers respectively and forming a multilayer barrier film could meet flexible electronics barrier property requirement. And this multilayer barrier film will be applied to flexible electronics encapsulation in the near future.

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