微域加熱晶片之模擬分析與製作

Analysis and Fabrication of the Micro-Domain Heating Chip

廖基宏(Chi-Hung Liao)

指導教授 ： 陳志堅

國立屏東科技大學/工學院/生物機電工程系所/碩士(2009年)

https://doi.org/10.6346/NPUST.2009.00097

摘要

本研究目的是研發在晶片上的微域加熱器。利用軟體CFD-ACE+TM模擬設計微域加熱晶片，晶片上設計兩個不同溫度的恆溫區，晶片底部佈置兩組微加熱器。為達到恆溫的要求，使用三種加熱器的圖樣，一為在恆溫區下方佈置環狀加熱器，另一為在恆溫區底部放置面狀加熱器，結果顯示恆溫區的平均溫度和溫度標準差均為前者優於後者。為達更精確的恆溫效果，探討環狀微加熱器的幾何參數，對恆溫區溫度分佈的影響。結果顯示環狀加熱器較接近恆溫區時，熱能會使恆溫區內部溫度有疊加效果。同時改變兩恆溫區和兩加熱器的間距，距離越近，因溫度的疊加效應，無法明確顯示兩個恆溫區的區別。增加加熱器寬度對提高恆溫區的溫度有大的助益，在接近晶片邊緣區域，可藉由增加加熱器寬度，讓恆溫區範圍擴大。當晶片加上上蓋後，系統熱質量增加，明顯降低晶片的溫度。運用微機電製程方式製作電極，透過物理氣相沉積方式將金屬材料鋁鍍於矽晶圓。實驗結果顯示，利用鋁材料製作微感測器，獲得其升溫曲線，透過熱電偶溫度量測來進行校正，驗證感測器的穩定性。實驗結果與模擬結果趨勢相近。

關鍵字

微域加熱 ； 恆溫區 ； 環狀加熱器

並列摘要

The goal of this research is to develop micro-domain heaters on chips. Using software CFD-ACE+TM to simulate the thermal fields of micro-domain heating chip, there are two different constant temperature regions designed on the chip, and the two micro heaters are fabricated at the bottom of the chip. In order to achieve the requested isothermal areas, we use three kinds of heater's patterns in our designs. Two are for arranging the ring-shaped heater underneath the constant temperature area, the other one is for arranging the area-shaped heater. Results show that the former values of the temperature standard deviation are smaller than the latter. Results show that the former values of the temperature standard deviation are smaller than the latter. We discuss the effects of various geometric parameters of the ring-shaped micro heater on temperature distributions. The result demonstrates that the superimposition of thermal effects can be seen inside the domains whereas the heaters are positioned near the micro-domains. Whereas the distances between two micro-domains and two micro-heaters are reduced simultaneously, it is unable to demonstrate the boundaries of the micro-domains clearly. The isothermal areas could be enlarged by increasing the width of the heater near the boundary of the chip. Based on these simulation results, the heating chip is fabricated by MEMS method. Using the physical vapor deposition method, the aluminum material is deposited onto silicon wafer. Experimental results display that the heating curve of the aluminum micro sensor can be obtained. To calibrate the sensor temperature by the thermocouple, we can prove the stability of the micro sensor element. The tendency of the experimental and simulated results is approximate.

並列關鍵字

micro-domain heating ； isothermal area ； ring-shaped heater

參考文獻

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