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  • 學位論文

CO2雷射退火技術應用於生物晶片微管道之製作

Fabrication of the Microfluidic Channel for Biochips using CO2 Laser Annealing Technique

指導教授 : 張金龍 傅龍明

摘要


在本研究中,CO2雷射退火技術由於其製程的便利性而被使用在生物晶片微管道之製作。當CO2雷射照射在氧化銦錫(ITO)材料上其性質將發生變化,它的原子結構將會予以重新排列,從非結晶(amorphous-ITO , a-ITO)改變成結晶(crystallized-ITO , c-ITO)型態,當使用草酸(C2H2O4)對ITO進行蝕刻時,因為a-ITO的蝕刻速率比c-ITO快速,凸型微結構將附著在玻璃表面上。再利用熱壓(PMMA)與表面氧電漿(PDMS)完成微管道加工之製作。整個製程大約花費30分鐘,而且與傳統半導體製程簡單的多。製程上塗佈、曝光、顯影將可被省略。因此,對於製作MEMS上的微結構母模,CO2雷射退火技術是一項技術上的革新。此外,實驗結果顯示傳統半導體製程製作生物晶片微管道與CO2雷射退火技術有很好的一致性。在掃描式電子顯微鏡(SEM)與原子力顯微鏡(AFM)觀察下亦能證明上述之結果,所以CO2雷射退火技術可應用於生物晶片微管道之製作。

並列摘要


In this study, CO2 laser annealing technique was used to fabricate the microfluidic channel for biochips due to the convenience of processing. Indium-Tin Oxide (ITO) material properties will be changed as CO2 laser irradiates on it. Its atomic structure will be rearranged from the amorphous-ITO(a-ITO) to the crystallized-ITO(c-ITO). Because the etching rate of a-ITO is faster than crystallized ITO (c-ITO) using oxalic acid (C2H2O4), the convex type micro-structure would be attached to the glass surface after etching. Then use thermal of press PMMA and oxygen plasma processing (PDMS) to complete the production of microchannels. The entirely processing costs about 30 minutes, which is very simply compared to the traditional semiconductor processing. All the processing such as spin coat, exposure, and lithography will be left out. Hence, CO2 laser annealing technique is a technological innovation for the fabrication of microstructure mold in MEMS. Besides, experimental results showed that there are in a good agreement with the traditional semiconductor processing for the fabrication of microfluidic channel for biochips using CO2 laser annealing technique. The observations of scanning electron microscope (SEM) and the atomic force microscope (AFM) can also prove the above-mentioned result. Therefore, CO2 laser annealing technique can apply to the fabrication of the microfluidic channel for biochips.

參考文獻


25.李英群,2005,石英基材之奈米加工技術及其在壓印上的應用,碩士,台灣大學,生物產業機電工程研究所,台北。
36.陳毓儒,2004,低溫多晶矽薄膜製程之研究,碩士,國立成功大學,工程科學系碩士論文,台南,第81 頁。
1.Burns, M. A., 2002, Everyone's a (Future) Chemist.Science. 296, pp.1818-1819.
10.Hiroyuki, K., and Takashi, K.,1992,”Improving the uniformity of Poly-Si films using a new excimer laser annealing method for Giant-microelectronics,” Jpn. J. Appl. Phys. 31, pp.4550-4554.
11.Kenji, S., Fujio, O., Hiroyuki, U., Shinji, I., Setsuo, K., and Kazuaki, H., 1989,” High-performance TFT’s fabricated by XeCl excimer laser annealing of hydrogenated amorphous-silicon film,” IEEE Transactions on Electron Devices. 36(12), pp.2868-2872.

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