摘要
目前的構裝形式皆需以銲錫來黏著晶圓內外線路間的訊號，但在銲錫黏著後，當有不良品產生時，即有修整不易，造成成本過高之情況發生。本文針對此缺點，設計一新型構裝形式，來改善之。 此設計主要利用矽晶片晶格方向之特性作為構裝定位裝置，及懸臂結構作對外訊號連結，結合兩種結構來設計可替換式構裝裝置。首先，將<100>矽晶片利用蝕刻液蝕刻54.74度之凹槽作為晶片座之功能，再將蝕刻好之凹槽利用顯影、蝕刻之微機電製程電鍍出懸臂樑結構，以用來做為線路傳輸。接下來在裸片的部分，利用電鍍的方式沈積出凸塊，作為裸片對外傳輸線路之途徑，完成後再以PI光阻作為定位密封。 經組裝後，量測構裝體之電阻值為1.7Ω，而懸臂樑結構在經模擬及理論推導驗證下，結構也不致破壞。證明此新式構裝不但可以解決凸塊大小不均之缺點，並且又能使構裝體達到導通的要求。
並列摘要
The present packaging methods require soldering to connect the signals between the internal and external circuits of the silicon wafer, but if a defect is arisen after the soldering, it will be difficult to recondition the defect and the cost will be increase. In this study, the novel packaging method is presented the easy replacing package provide. This design primarily uses the characteristic of the lattice direction of the silicon wafer as the packaging frame structure and the cantilever beam structure as the connection line with external signals. These two structures are integrated together into the design of a replaceable packaging device. Firstly, the <100> silicon wafer is etched a cavity of 54.74 degrees by an KOH etchant; and then the solder bump and cantilever beam structure uses the photolithography and electroplate process. The cantilever beam is deposited by electroplating and acts as a path for the circuit transmission. For the bare chip, the bump is deposited by electroplating and acts as a path for the external transmission circuit. At the least, a PI photoresist is used for the fixed seal. The resistance is 1.7Ω after the packaging and the cantilever beam structure will not be damaged under the decrease and verification of the simulation and theory. It shows that the novel packaging method not only solves the shortcoming of the uneven sizes of the bump but also transmit the electric connection requirements of the package.
參考文獻
延伸閱讀
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