應用熱壓崁入技術製作電容式壓力感測器

FABRICATION OF THE CAPACITIVE PRESSURE SENSOR BY THE HOT EMBEDDING TECHNOLOGY

吳裕弘(Yu-hong Wu)

指導教授 ： 簡昭珩

大同大學/工程學院/機械工程學系所/碩士(2008年)

摘要

熱壓技術是種發展許久的技術，由於模具技術上不斷的翻新，從最基本的熱壓成型到微結構熱壓，ㄧ直到目前的奈米轉印都有，在應用面上相當廣泛。
本篇論文主要目的為利用微機電製程技術(Micro Electro MechanicalSystem,MEMS)與熱壓技術製作電容式壓力感器。模具方面可分為熱壓崁入模具與熱壓成型模具兩部份，壓力感測器結構製作方面主要利用熱壓成型與熱壓嵌入技術進行製作。
本研究特點為利用熱壓崁入技術將模具上之金屬結構崁入至壓克力中，由於金屬結構崁入壓克力(PMMA)之接合力則大於金屬結構和二氧化矽(SiO2)底材表面，因此拔模後，金屬結構則脫離底材表面崁入至壓克力。本研究利用熱壓成型及熱壓崁入交互進行，使兩金屬結構間產生一平行間距，成功製作出電容壓力感測元件，經測試後壓力量測範圍為0-45psi。由於感測器放大電路為電容轉頻率之方式輸出，靈敏度為1.1kHz/psi，換算後電容值為0.0171 pF/psi。

關鍵字

電容壓力感測器 ； 微機電 ； 熱壓成型 ； 熱壓崁入

並列摘要

Hot embossing technology has been developed for many years. This technique keeps updating and is used in many different way-from normal embossing to microstructure fabricating.
In this research, Micro Electro Mechanical System is used to fabricate the hot embossing mold. The mold can divide into the hot embedding mold and the hot embossing mold. The pressure sensor structure is fabricated by hot embedding and hot embossing technology.
Hot embedding technique is used to embed the metal structure into PMMA. When the temperature decrease, therefore, the adhesion of metal structure to SiO2 is difficult, the metal structure could be easy embedded into PMMA. In this research, the operator range of capacitive pressure sensor is 0-45psi. The sensitivity of the out put frequency is 1.1kHz/psi, and capacitance sensitivity is 0.0171 pF/psi.

並列關鍵字

MEMS ； Hot embossing ； Hot embedding ； Capacitance

參考文獻

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