電熱激振微幫浦裝置薄膜之模擬與量測

本文主旨為針對微幫浦與微閥門薄膜熱電激振方式，進行簡易模型、熱阻模型及ANSYS有限元素分析法各方面元件熱源與薄膜膨脹之模擬，藉此瞭解裝置致動可行性。本研究電熱激振量測實作方面，應用紅外線熱影像測溫儀量測裸線、封裝後熱源及動態溫度曲線。同時，本研究自行製作微線圈加熱電路，配合FFT動態信號分析儀及雷射位移感測系統，進行微幫浦薄膜熱動位移量測分析，藉以驗證電熱升溫激振系統及薄膜膨脹位移程度。最後，本文以VHDL撰寫PWM輸出波形並配合功率放大電路，進行該電熱激振微幫浦系統中四閥門與一幫浦的控制，並藉由微量天秤量測獲知該系統之流量效率為2.4 μl/min。

關鍵字

電熱激振；微幫浦；微閥門；溫度分佈；熱像儀；膨脹位移

並列摘要

The main purpose of this study is to investigate an overall electric heat vibrated micro-pump system, including the sketching of a theoretical thermal resistance model for the micro-pump structure, comparison with simulation results from the micro-pump finite element method (FEM) models, fabrication as well as packaging of all the micro-pump constituents for transporting bio-fluids, an FPGA chip with an embedded PWM mechanism to trigger energizing circuits for the heating coils of the micropump and double micro-valves, and consequently their thermally excited membranes to perform pumping and gating functions, respectively, for the bio-fluids to be transported. In the study, an infrared thermography image grabber, a laser interferometer along with an FFT dynamic signal spectrum analyzer, and a micro electrical balance are employed to perform measurements on the achieved system temperature distributions, thin membrane pumping displacements, and bio-fluid transport efficiency. The experimental results are compared with what obtained from the FEM models.

並列關鍵字

Electric heating excitation ； micro-pump ； micro-valve ； temperature distribution ； thermography ； membrane displacement

國際替代計量

電熱激振微幫浦裝置薄膜之模擬與量測

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