Display edges have to be stuck with ICs, and thus Cartesian coordinate robots are used to undergo outer lead bonding. In this study, robotic vibration analysis was conducted to meet the goal to investigate vibration produced during bonding process. First, we constructed models of gantry, bonders, and base structure, then the models were imported into ANSYS software to set the mesh and analysis conditions as well as to reconfirm the precisions of models. Forty modes were obtained in modal analysis employed in transient analysis by the mode superposition method. Consequently, the analysis results will be used to observe the dynamic behavior and numerical values of structure in vibration so as to find out the critical positions of the weak point and maximum amplitude to improve the robot design.