摘要
免封裝晶片已成為封裝的發展趨勢，本文使用覆晶二極體來製作免封裝晶片，不但可提高散熱並增加出光角度，且能免除傳統打線的失效，簡化製程提升良率，縮小封裝面積。另外，使用平坦化機台製作螢光膠層，可減少螢光粉用量，達到控制成本的目的。經由實驗分析知消耗功率為1W時，色溫3000K（以下稱 WFC-3000）封裝體光通量為104.41 lm，色溫4000K（以下稱WFC-4000）封裝體光通量為113.74lm。持續點亮30分鐘，色溫3000K熱穩定時的光通量為90.43lm。色溫4000K熱穩定時的光通量為99.48lm。與傳統封裝5630相比可達到相同水平之光通量，但因散良好光衰可降約為1-2%。
並列摘要
This paper introduces a novel package-free chip (PFC) fabrication technology for white LED. It also reports the characterizations of optical properties and thermal effect for the devices produced. The white LED PFC can increase the heat-dissipation ability and lighting angle for device's indoor lighting applications. The white LED PFC can also eliminate the failure of wire bonding, simplify the packaging process and achieve high-yield production. The luminous fluxes of the white LED PFC measured were about 104.41 lm at 3000K and 113.74 lm at 4000K, respectively, under the applied power of 1 W. A further investigation showed that the heat steady luminous flux are 90.43 lm at 3000K and 99.48 lm at 4000K, respectively under a continuous burning for 30 minutes.
延伸閱讀
- 張媛婷（2013）。白光LED不同封裝結構之發光效率研究〔碩士論文，國立臺北科技大學〕。華藝線上圖書館。https://doi.org/10.6841/NTUT.2013.00008
- 蘇忠傑（2014）。多功能白光發光二極體封裝技術。科儀新知，(199)，74-80。https://www.airitilibrary.com/Article/Detail?DocID=10195440-201406-201406190012-201406190012-74-80
- Chen, C. T. (2017). 新穎螢光粉用於白光LED封裝之製備與發光特性研究 [master's thesis, Chung Yuan Christian University]. Airiti Library. https://doi.org/10.6840/cycu201700361
- 羅梅君、安振基（2012）。照明用白光LED定量螢光光譜測試與白光色彩結構在LED封裝工業上的應用。中華印刷科技年報，()，396-404。https://doi.org/10.30153/JCAGST.201206.0030
- 陳人豪（2011）。Single-chip white LED by using GaN blue LED with photon-energy-conversion layer〔碩士論文，中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu201100919