In this study, Y_2O_3, HfO_2, Al_2O_3 was evaluated as a gate insulator for thin film transistors fabricated using an amorphous InGaZnO (α-IGZO) active layer. The RMS roughness of the Y_2O_3 film was improved from 0.498 nm to 0.221 nm by employing an RF (magnetron sputtering) Al_2O_3 underlayer. Using the optimized Y_2O_3 deposition conditions, thin film transistors (TFTs) were fabricated on a glass substrate. The important TFT device parameters of the on/off current ratio, sub-threshold swing, threshold voltage, and electric field mobility were measured to be 4.7×10^4, 0.18 V/dec, -0.3 V, and 11.7 cm^2/Vs, respectively. The stacked insulator consisting of Y_2O_3/Al_2O_3 was highly effective in enhancing the device properties.
在這項研究中,Y_2O_3、HfO_2、Al_2O_3被評估為使用非晶InGaZnO(α-IGZO)通道層製造的薄膜電晶體的柵極絕緣層。透過使用RF(磁控濺射)Al_2O_3底層將Y_2O_3膜的RMS粗糙度從0.498 nm降低到0.221 nm。使用優化的Y_2O_3沉積條件,在玻璃基板上製造了薄膜晶體管(TFT)。TFT元件的重要參數分別為開/關電流比,亞閾值擺幅,臨界電壓值和電場遷移率,分別為4.7×10^4,0.18 V/dec,-0.3 V和11.7 cm^2/Vs。由Y_2O_3/Al_2O_3組成的堆疊式絕緣層在增強器件性能方面非常有效。