本論文是探討Express Card連接器在塑膠射出成形(injection molding)後之翹曲變形,搭配田口方法(Taguchi Method)作實驗分析。本研究採用L18(21x37)直交表,八個控制因子:射出流率、模具表面溫度、熔膠溫度、保壓壓力、保壓時間、澆口大小、塑料型號以及塑膠掏肉之結構。同時在每一組實驗中,加入模具表面溫度及熔膠溫度之變化為干擾因子進行Moldflow模流分析。塑膠射出模具設計為一模四穴,進澆點是以潛伏式澆口的型式。研究結果顯示,最佳的參數組合分別為:塑膠材料PA9T(GN2330)、塑料流動速率15 cm3/s、模具表面溫度135℃、進澆點尺寸0.7 mm,以及一段塑膠掏肉。Z軸的翹曲量為0.16 mm,比原始設計的翹曲量0.21mm有大幅改善。
This theme is to study the warpage of Express card connectors, which produced by injection molding. Taguchi Method was used for the experimental analysis. This study also utilize L18 (21 × 37) orthogonal array including the eight control factors: injection flow rate, mold surface temperature, melt temperature, packing pressure, packing time, gate size, plastic materials, and reducing wall thickness. In each experimental process, mold surface temperature and melt temperature were chosen for the noise factors to progress the Moldflow analysis. The injection mold was designed for cavities and submarine gate. Results show the optimized parameters are: PA9T (GN2330), plastic flow rate of 15 cm3/s, mold surface temperature 135℃, gate size of 0.7 mm, and a section of reducing wall thickness. The warpage 0.16 mm of Z axis direction was improved than the original warpage of 0.21mm.