覆樹脂銅皮材料運用於除膠渣流程與無電鍍化學銅流程之製程與研究

本文是針對印刷電路板的PTH製程中，通常為了可監控無電鍍銅化學銅沉積的厚度與製程中除膠渣流程的樹脂咬蝕量監控，針對原本使用B級基板（FR-4）材質來作業Desmear咬蝕量監控或PTH無電鍍銅化學銅沉積，為了求其於製程監控的穩定性，故為了得到較穩定的數據與減少使用市面上所販售不知道是何種材質的B級（FR-4）基板所測得不穩定的數據，所以將實驗設計分為三個部分：第一部分為確認印刷電路板PTH製程現場所使用B級基板所測得數據與水準，並且評估使用台灣銅箔RCC MR500 80T18板材來取代舊有使用的B級基板，同時重新制定其新管控數值，同時發現RCC MR500咬蝕量是FR-4 B級基板的 1.6~2.3倍。第二部分評估台灣銅箔RCC MR500 80T18板材作業Desmear流程時，當改變流程中的高錳酸鈉工序浸泡時間與溫度、膨鬆工序浸泡時間與溫度，對於台灣銅箔RCC MR500 80T18板材咬蝕出來之樹脂咬蝕量的監控與外觀型態變化、粗糙度的關係，結果發現隨著咬蝕量的上升，RCC無銅基板表面粗糙度愈大，且外觀表面孔洞也愈大。第三部分評估台灣銅箔RCC MR500 80T18板材作業Desmear流程之後，搭配無電鍍銅流程後，確認隨著除膠渣流程之咬蝕量不同，對於無電鍍銅流程沉積化學銅的影響，並於實驗中發現，當粗糙度愈大，再固定浸泡化學銅時間下，其化學銅沉基量愈大，但當RCC咬蝕量達一定的數值時，化學銅沉積量將不在上升。

關鍵字

除膠渣；無電鍍銅； RCC材料；鍍通孔

並列摘要

In the past, the printed circuit board industry (PCB) use the fiberglass epoxysubstrate (FR-4) to monitor the Desmear (resin etching amount) and the Plated through hole(Electroles-s copper weight gain) process, but the FR-4 have many different suppliers make the testresulthave many variables. In this paper, we try to fixed substrate material change the test material fromFR-4 to the RCC MR500 80T18 (The supplier is Taiwan Copper Foil Co., Ltd.), for a stable processmonitoring indicators. The experiment included three parts. The first part, we confirm the current use the fiberglass epoxy substrate (FR-4) test results. Assessed using the RCC MR500 80T18 to replace the FR-4 and re-development of new control specification. We find the RCC MR500 80T18 desmear weight loss is1.6 ~2.3 multiples to the FR-4. The second part, we try to change the desmear process (Sodium Permanganate and Sweller Tank) immerse time and working temperature to correlation about the RCCMR500 80T18 resin etching amount and appearance and surface roughness. With the increase in the RCC MR500 80T18 resin etching amount, the substrate surface roughness and theappearance of surface holes are greater. The third part, we try to confirm the different RCC MR500 80T18 resin etchingamount test board for the Electroless copper (E`less copper) process of the electroless copper weight gain. When the greater the surface roughness, the e`less copper weightgain of the greater, but the resin etching amount to the some value the e`less copper weight gain will not rise.

並列關鍵字

Resin Coated Copper ； Desmear ； Electroless Copper ； Plated Through hole

參考文獻

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【1】林定皓、藍國興、商育傑、卓明杏、唐守政、粱信森、黃祖義，印刷電路板孔內清潔技術，孔壁金屬化，印刷電路板產業學院，第三章，第3.3.2節，2012，第41-43頁。

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覆樹脂銅皮材料運用於除膠渣流程與無電鍍化學銅流程之製程與研究

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