高密度直流電源供應器散熱之研究

A Study of Thermal Management for High Density DC Power Supply

黃凱鴻(Kai-Hung Huang)

指導教授 ： 王金樹

國立臺北科技大學/機電學院/機電整合研究所/碩士(2006年)

摘要

近幾年來，隨著全球功率半導體元件、控制IC及被動元件等技術的快速進步，促成了電力電子技術及其應用領域的高度發展，例如微電子技術革命性的突破，使得控制器使用之積體電路及信號處理器的功能得以更加增進：半導體製造技術的進步也大幅提高了電力處理器所採用之功率半導體元件的容量及切換速度；所以直流電源供應器之功率密度也隨之增加，產品散熱問題成為設計時重要關鍵。
本實驗研究以456 瓦直流電源供應器為對象，其功率密度已經超過以前習知之設計（300W），利用強制對流較經濟之手段，以達到較經濟之設計。
本研究先利用數值模擬分析軟體FLOTHERM，作為直流電源供應器設計初期數值模擬，以確認設計方向之正確性。再以實際產品分兩種方法作驗證：一為使用紅外線熱影像偵測儀測出直流電源供應器上之熱點分佈的情況；另一為利用風洞設備量測直流電源供應器工作時實際溫度數值，相互驗證兩種量測方式之數值比對，以確認數值之正確性。最後結果分析如下所述：1. 比對數值模擬的分析與實際量測值偏差，發現初期電子設計效率之偏差將影響數值模擬正確性；2. 如何以較經濟之設計，達到散熱之目的分析方法及結論建議。
本研究提供SPS業界標準產品設計散熱流程，並告知如何測試產品Thermal之方法；其文中亦提及許多相關SPS電子產業之零件資料及參數，可以作為日後相關產品設計之依據。

關鍵字

直流電源供應器 ； 功率密度 ； 數值模擬

並列摘要

In the past few years, the explosive growth of global semiconductor industry has lead to a breakthrough of advanced development in application of embedding microcomputers many IC arenas, especially in the designs of those Power Microcontrollers and Passive IC components. Take the example of Power Microcontrollers ICs, the revolutionary break through of VLSI fabrication technology advances the capabilities of microelectronics and signal processing application; especially in the areas of increasing the density IC components within an unit and their operating frequency. Simply governed by physics, the power density amplifies along with the growth of power-consuming components in DC Power Supplies; device’s heat dissipation specifications are naturally inherited as challenges in designing DC Power Supply Units.

This experiment takes 456W DC power supplies as the target of study. Knowing power density of such PSU exceeds the already familiar 300W PSU; the economical design approach to combat its additional heat dissipation is by means of deploying a stronger forced convection.

This research uses the industry-approved computational fluid dynamics thermal analysis software FLOTHERM as the initial heat dissipation simulation tool to first validate the design of the DC PSU. The research then further validates the design by undergoing two investigative stages using live products: One, using IR thermal-imaging equipments to map out the heat dissipating, and the distributions of, hot-spot areas from the DC PSU. Secondly, using a well controlled wind tunnel thermal-measurement equipments to take the actual temperature measurements while the DC PSU is operating under normal conditions. After manually comparing and contrasting these two controlled evaluations, from the validity and accuracy of the design aspect, the following conclusions are drawn:
1. Evidently shown by the deviations of simulated analysis and the actual measurement values perspective, the deviation of the electronics’ efficiency designed in the early designing stage fluctuates the simulated values in accuracy.
2. The approach of achieving effective heat dissipation with economical design methodology was found in from the heat dissipating simulation process.

This research not only provides the SPS industry- standard design process flow of product’s heat dissipation design, but also broadcasts the thermal testing methodologies of a product. In addition, this article provides the kit datasheets, parameters, and specifications of many related industry of SPS electronic components; these can be referenced in the future for DC PSU designs and applications.

並列關鍵字

DC Power Supply ； Power Density ； Simulation Analysis

參考文獻

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