依據國際半導體市場研究機構整理報告(楊智家,2020),測試暨相關設備市場空間,2020年約61億美元,因新冠狀病毒疫情影響,2021年測試暨相關設備市場持平或略微提升,預估約62億美元市場。測試用探針約占封裝成品測試業務營收之2~5%為主要耗材費用之一。 而在封裝測試領域上,相對應的測試介面發展也是半導體發展領域上重要的一環,諸如晶圓測試的探針卡與晶片測試的探針座,都是在半導體領域上不可缺少的耗材開發;業界相關機構也極力追求維護方法與相關材料製程改善以增加其生產使用的效益。 本研究利用同步工程與六標準設計架構與方法,並運用過程決策計劃圖、魚骨圖、因果矩陣圖、實驗設計,進行產品開發與改善;有效的縮短開發時間,提升該案產品良率超過10%與生產效率提升20%以上,更建立了新產品導入緊急改善機制;成功的提升客戶的信賴度與後續擴產的意願。
According to VLSI Research and DIGITIMES, the market value for testing and related equipment is about 6.1 billion U.S. dollars in 2020. Due to the impact of the COVID-19, the testing and related equipment market size will be the same or slightly increase in 2021, with an estimated market of about 6.2 billion U. S. dollars. Test probes account for about 2~5% of the revenue of the packaged product test business as one of the key consumables. In the field of packaging and testing, the test interface such as a wafer test probe card holder and the test probe device is also an important part of the equipment research and development. Related organizations in the industry are also striving to improve maintenance methods and related material manufacturing processes to increase the efficiency of production and use. This research applies concurrent engineering and six sigma frameworks along with methods such as process decision plan chart, fishbone diagrams, causal matrix diagrams, and design of experiment to develop and improve probe device. Results effectively shorten the development time, increase the product yield rate of this case by more than 10% and increase the production efficiency by more than 20%, and establish a rapid improvement mechanism for new probe device introduction, which successfully increase the trust of customers and willingness to enlarge production capacity.