Fabrication of Metal Grid on Silicon-Based Solar Cell by Electrochemical Deposition and Microcontact Print

利用電化學沉積和微米壓印法應用於矽晶太陽能電池上導線的製作

林志賢(Chih-Hsien Lin)

指導教授 ： 萬其超 ； 王詠雲

國立清華大學/工學院/化學工程學系/碩士(2010年)

摘要

This work presents a novel and low-cost printing technique to construct a three-layer (Pd/Ni/Cu) structure as front-side conductor of textured mono-crystalline silicon solar cells. The technique involves microcontact printing and electrochemical deposition. Electrochemical deposition including electroless Ni and electroplated Cu offers an inexpensive method in contrast to the conventional silver-paste. The first step of this technique was activation by Pd nanoparticles. The Pd nanoparticles with average particle size about 2.65 nm were then mixed with organic solvent to prepare Pd ink. Then we imprinted Pd ink on the front side of solar cell by microcontact printing, which could print fine-lines of less than 60 μm width. The second layer is electroless nickel providing low contact resistance and good mechanical adhesion. The third layer is electrodeposited Cu to increase the line conductivity. X-ray Diffraction (XRD) technique, Secondary Electron Microscopy (SEM) and X-ray Photoelectron Spectroscopy (XPS) were employed to detect the presence of nickel-silicides phase and the thickness of nickel-silicides phase after annealing. Moreover, the depth profile of metal contact was determined by Secondary Ion Mass Spectrometry (SIMS) and Electron probe X-ray Microanalyzer (EPMA). Finally, the line conductivity of three layer structure is lower than silver paste, and this new scheme has proven to be workable and may become an alternative approach for surface metallization on solar cell.

關鍵字

矽晶太陽能電池 ； 無電鍍鎳 ； 微米壓印 ； 金屬化 ； 電鍍銅

並列摘要

無資料

並列關鍵字

silicon-based solar cell ； electroless Ni ； microcontact print ； metallization ； electroplating Cu

參考文獻

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