- 學位論文
應用田口方法提高SMT 微型元件之銲錫性-以0201元件銲接改善為例
Application of Taguchi Methods for Optimization of SMT Ultra Small Chip’s Solderability –A Case Study of Soldering Improvement for 0201 Chips
本文將於2025/06/30開放下載。若您希望在開放下載時收到通知，可將文章加入收藏。
延伸閱讀
- 劉建志（2009）。利用田口法分析對PBGA封裝體之錫球的可靠度影響〔碩士論文，中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu200901491
- Jill, L. C. (2016). 藉由銲料中銀含量的調變與表面處理材料之選擇探討錫銀銅焊接系統於高低溫循環測試下之失效機制與可靠度 [master's thesis, National Chiao Tung University]. Airiti Library. https://www.airitilibrary.com/Article/Detail?DocID=U0030-0803201714371343
- 李俊蒼（2008）。無鉛錫球的孔洞對覆晶球柵陣列構裝元件之可靠度影響研究〔碩士論文，元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-2807200810414200
- 石志聰 (2011). Design and Analysis of Metal-Oxide-Semiconductor-Capacitor Microring Optical Modulator with Solid-Phase-Crystallization Poly-Silicon Gate. 光學工程, (113), 7-18. https://doi.org/10.30011/OE.201104.0002
- Mughal, M. A., Newell, M. J., Vangilder, J., Thapa, S., Wood, K., Engelken, R., Carroll, B. R., & Johnson, J. B. (2014). Optimization of the Electrodeposition Parameters to Improve the Stoichiometry of In_2S_3 Films for Solar Applications Using the Taguchi Method. Journal of Nanomaterials, 2014(), 292-301-133. https://doi.org/10.1155/2014/302159