八吋晶圓廠房昇級為十二吋晶圓廠房之改善型工廠佈置─以半導體 A 廠蝕刻區為例

Facility Relayout Planning of Etch Area for Shifting From a 200mm-wafer to 300mm-wafer Factory

劉品蘭(Piin-Lan Liu)

指導教授 ： 王孔政

中原大學/工學院/工業工程研究所/碩士(2003年)

https://doi.org/10.6840/cycu200300043

摘要

將既有半導體八吋晶圓廠透過系統化重新佈置， 升級為十二吋晶圓廠極具產業發展經濟效益。 惟十二吋晶圓廠的製造設備與八吋晶圓廠需求不盡相同， 且對於晶圓自動傳送系統的需求程度較高， 將既有之八吋晶圓的機器設備以及設施轉變成為生產十二吋晶圓的使用， 必須面對產能規劃、 廠房規格、 操作動線、 水電氣供應量、 污染處理、 潔淨需求等關鍵問題， 還須兼顧以最低的成本， 使晶圓廠順利的產出高良率、 高品質之十二吋晶圓。
本論文探討八吋晶圓廠蝕刻區升級成為十二吋晶圓廠之空間規劃。 利用原有的八吋晶圓廠工廠佈置以及廠務設施進行其可行性評估。 提出八吋晶圓廠升級為十二吋晶圓廠之評估流程， 並以流量矩陣分析蝕刻區三種不同之生產設備佈置模式， 以成本、 面積、搬運距離、 效益、 生產設備數量與生產設備使用率作為衡量基準， 求解晶圓廠升級之較佳方案。

關鍵字

蝕刻區 ； 改善型工廠佈置 ； 晶圓廠

並列摘要

To retrofit the existing facility of 8” FAB into 12” FAB’s， that is the most industrial economic size， in terms of systematic method is one of the most popular topic now. But facility required by 12” FAB is quite different from that of 8” one’s， especially in the field of automatic material handling system. There are some hurdles while transferring both facility and equipment of 8” FAB into 12” FAB might suffered. They are capacity allocation， specification of facility， operational shop flow control， supply of wafer and electronic， treatment of pollution， the requirement of smoke room. Besides to the hurdles listed above， low cost， high yield， and high quality are other challenges of 12” FAB.
Layout and facility retrofit of Etch area of 8” FAB into 12” FAB is the topic of this thesis. Perform feasibility analysis based on layout and facility of 8” FAB. Analysis flow of retrofit is provided by way of flow rate matrix analysis for 3 types of layout. Take cost， area， moving distance， benefit， equipment quantity， and equipment utilization rate as measurement criteria to find the best solution of FAB retrofit.

並列關鍵字

Etch ； Modified factory layout ； Semiconductor fab

參考文獻

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