半導體封裝廠有限產能投料模式之研究

A Study of Order Release with Limited Capacity in IC Package Factory

蕭明誌(Ming-Chi Hsiao)

指導教授 ： 陳建良

中原大學/工學院/工業工程研究所/碩士(2007年)

https://doi.org/10.6840/cycu200700785

摘要

IC封裝廠典型的瓶頸站為銲線製程，而投料規劃對於該類工廠的整體績效具有關鍵性的影響。本研究提出一套投料模式，建構以有限產能為基礎的投料模式並利用該模式來求解適合銲線製程的投料順序與產品數量。本研究以達交率與機台使用率來做為績效指標，運用Microsoft Excel的規劃求解進行模式驗證，並利用個案工廠的實際資料與實驗設計方法，針對機台使用率和產品達交率進行績效評估。從實驗設計的結果顯示，本研究的投料模式相較於傳統的投料模式，可以有效改善IC封裝廠的績效。

關鍵字

投料模式 ； 產能規劃 ； IC封裝

並列摘要

Order release is crucial to the performance of IC packaging factories where wire bond is a typical bottleneck process in this industry. This research proposes an order release policy based on finite capacity to determine the sequence of orders and product types to be processed by wire bond machines. On-time delivery rate and machine utilization are used to evaluate the performance of the proposed policy. A case study using data from real IC package factories was conducted and the design of experiments was used to evaluate the effectiveness of the proposed order release policy. Simulation results show that, compared to traditional order release alternatives, the proposed order release policy can significantly improve the IC packaging performance.

並列關鍵字

Order Release ； Capacity Planning ； IC Package

參考文獻

【26】蕭佳毓，“晶圓製造廠考慮批量優先序之動態派工研究”，中原大學工業工程學系碩士論文，2001年。

【18】邱俊智，“有限產能下之投料模式構建與應用之研究--以半導體測試廠為例”，中原大學工業工程學系碩士論文，2001年。

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