CPU冷卻系統之創新作動式隧道型散熱座技術

An Innovative Active Liquid Heat Sink Technology for CPU Cooling System

李洸毅(Guang-Yi Lee)

指導教授 ： 王松浩

崑山科技大學/工程學院/機械工程研究所/碩士(2008年)

摘要

本論文研製之現今科技日新月異，隨著半導體製程技術的增進以及摩爾定律，中央處理器(CPU)的運算核心晶片製程從2000年的單核心Intel® Pentium® 4處理器90奈米(nm)處理器問世後，短短六、七年內Intel於2007年在舊金山發表可實際運作的四核心32奈米(nm)製程技術，甚至在未來的一到兩年內會推出八核心或是更多晶片整合的多核心中央處理器。
因此隨著運算功率逐漸增加，相對的所產生的熱能也持續攀升，現今CPU散熱系統將無法應付未來高達350W的熱能窘境，有鑑於此我們以目前散熱效能最優異的水冷系統作為基礎架構，開發新一代的水冷散熱系統。
本文提出並敘述創新CPU中央處理冷卻系統之作動式隧道型散熱座(Active-Liquid-Heat-Sink；簡稱ALHS)技術。主要的概念及設計基礎，是整合作動式液體散熱座技術於內置型液體冷卻系統。
本系統不僅體積小，重量輕，安裝方便，且透過與美國ASTM-5470D標準符合的 LW-9091CPU測試儀，實驗結果證實本系統具有優異的散熱效率；並經由與市售的空冷、熱導管及內置型液體冷卻系統做比較，也再度驗證本系統確實擁有較佳的散熱功能。

關鍵字

晶片 ； 散熱座 ； 散熱 ； 系統

並列摘要

With great advancement of science and technology, with the development of chip manufacturing processes, since the delivery of first single core Intel® Pentium® 90 nm process, an operational four core 32 nm processor has been announced in San Francisco in 2007. In the near future, micro-processors with more than four cores are on the way to the market.

It is obvious that with the increase of computational power, relative more heat is inevitable produced. Therefore, current CPU heat dissipation methods would be unable to deal with the higher heat-energy problem, as high as 350 watts. To cope with the situation, a new generation liquid cooling system is developed, based on and combining existing CPU cooling technologies.

In the paper, an Active-Liquid-Heat-Sink Technology is introduced for CPU cooling purposes. With this technology, the active liquid driving mechanism is integrated into the liquid heat sink, and the whole system can be assembled into a regular computer mother board.

The advantages of the system are not only its small size, light weight, convenient installation, but more importantly its very high cooling efficiency. Through the “LW-9091CPU Tester” that complies with U.S.A. ASTM-5470D standard, the experimental result verifies that this system has excellent thermal efficiency. Comparing with commercial air cool, heat pipe and internal liquid cooling systems, a better heat dissipation function of this system is testified.

並列關鍵字

CPU ； Cooling ； Heat Sink ； System

參考文獻

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