窗型球柵陣列構裝翹曲及熱應力分析

電子構裝因元件間的材料熱膨脹係數不同，在構裝製程的不同溫度負載下會產生膠體翹曲變形及構裝元件熱應力及可靠度問題。本論文為研究市面上常見之 DDRⅢ (Double Data Ram) 動態隨機存取記憶體DREAM(Dynamic Random Access Memory)構裝時所產生的翹曲、熱應力及可靠度問題。由於DDRⅢDRAM構裝採用WBGA(Window Ball Grid Array)型態，屬較先進尺寸構裝，為了得到較佳的電性及及反應速度，其佈線比較短，且膠體分別位於基板上下方也呈不對稱形態，故於構裝過程中易衍生出翹曲、熱應力及可靠度問題。本研究利用有限元素軟體ANSYS模擬預測翹曲並與實驗結果比較，並探討不同晶片尺寸，及膠體材料對構裝翹曲、熱應力及可靠度的影響。

關鍵字

構裝

並列摘要

The electronic assembly because of C.T.E(Coefficient of thermal expansion) and thermal stage are different between each components, that will lead to warpage , thermal stress and reliability issue during assembly process. The dissertation research DDRⅢ Double data Ram Dynamic Random Access Memory warpage, thermal stress and reliability issue. The finite element method is use to simulate the package warpage and reliability during manufacturing process. In this research use basic concepts of finite element method with software ANSYS simulate and forecast warpage compare with sample, then study different die size and molding compound for warpage , thermal stress and reliability relation.

並列關鍵字

Assembly

參考文獻

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9. Chiu, C. C.; Wu, C. J.; Peng, C. T.; Chiang, K. N.; Ku, T.; Cheng, K. “Failure Life Prediction and Factorial Design of Lead-Free Flip Chip Package”, Journal of the Chinese Institute of Engineers, vol.30, pp.481-490, 2007.

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窗型球柵陣列構裝翹曲及熱應力分析

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