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數位影像裂縫成長之研究

The Research of Crack Growth by Digital Image

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摘要


此研究係以利用雷射的折射原理形成焦散法來量測,焦散法是以雷射當光源,因試片在受負荷後,導致在裂縫尖端附近產生應力集中,造成試片厚度及光折射率的變化,進而透過影像處理系統來觀察其裂縫尖端產生的黑影直徑變化並紀錄下來,實驗數據透過Excel建立圖表觀察,分別整理出其斷裂前施力、裂縫長度、直徑、和應力擴大係數的相互關係,並分析及預測材料發生斷裂最終的施力範圍以及其他可預知的相關性。裂縫尖端因受施力後形成高應變區產生的條紋重疊,利用焦散法量測即可解決克服其它光學量測上的困難,並且在環境操作上也相當簡易。

關鍵字

焦散術 雷射 裂縫

並列摘要


This research utilized the principle of laser reflection to form caustics to observe the crack growth. When a material subjected to a load, stress concentration near the crack peak changes the thickness and the reflection of light. A CCD image system was used to record the shadow diameter. Excel was used to establish figures for comparison. The relationships between the crack length, diameter, and stress concentration factor before crack were established.

並列關鍵字

caustics Laser crack

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