隨著數位化的進步,人們用來紀錄周遭生活事物的工具種類變得愈來愈多。由於軟硬體開發技術的成熟以及生活上的便利需求,行動裝置的功能需求變得愈來愈多樣化。就硬體的觀點而言,過去文獻很少提到有關硬體實現影像接合之架構,目前大部分的影像接合研究僅僅在電腦軟體上處理,較少以硬體來實現。 本研究藉由Lyrtech公司的SignalWAVe開發平台,以德州儀器公司TMS320C6713BGDP255之DSP晶片,提出一個以基本的區塊比對方式,並配合相關係數之計算,以硬體實現接合數位影像之技術,發展成可攜性高的IC晶片。希望未來此IC晶片可適用在手機或數位相機上。
With the development of digital technology, the varieties of tools are available for recording people's daily life. Due to the maturity of software and hardware technology and convenience requirement of daily life, the function requirements of mobile device become more and more of variety. From the hardware point of view, literatures seldom discuss about the structure of implementing image mosaics. Currently, most of images mosaics are implemented in computer software rather than hardware. In this study, a block-matching algorithm of cross-correlation is proposed for image mosaics and a related IC is designed by Lyrtech's SignalWAVe development platform of TI DSP chip (TMS320C6713 BGDP255). We hope that this IC will apply to cell-phones or digital cameras.
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