7005/Al2O(下標 3(P))鋁基複合材料鍍銅行爲研究

Plating of Copper on An 7005/Al2O(subscript 3(P)) Metal Matrix Composite

林景崎(J. C. Lin) ； 鄭文達(W. D. Jehng)

《材料科學與工程》 35卷4期 (2003/12) Pp. 256-261

https://doi.org/10.6409/JMSE.200312.0256

摘要

Copper plating on 7005/Al2O(subscript 3(P)) metal matrix composite (MMC) is facilitated by a previously anodizing of the MMC. Anodizing conducted in phosphoric acid (P) is better than in oxalic (O) and sulfuric (S) acids. Cyclic anodic potentiodynamic polarization curve (CAPPC) in P shows a positive hyteresis with higher current density and greater gap between the forward and reverse scans. Scanning electron micrograph (SEM) depicts that the surface anodized in P is cleaner and smoother than anodized in O and S. Electrochemical impedance spectroscopy (EIS) demonstrates that the film produced in P has smaller resistance and capacitance. Cyclic cathodic potentiodynamic polarization curve (CAPPC) for the anodized MMC was applied to estimate the decomposition potential (DP) and crossover potential (COP) in copper sulfate. The value of DP is P＞O＞S but NOP reverses the order. The higher the DP, the more readily of copper plating; the less the NOP the easier nucleation of the deposits. Thus, the MMC previously anodized in P tends to obtain a refined and dense copper coat.

關鍵字

7005/Al2O(下標 3(P))鋁基複合材料 ； 陽極前處理 ； 鍍銅 ； 循環陽極極化法

並列摘要

Copper plating on 7005/Al2O(subscript 3(P)) metal matrix composite (MMC) is facilitated by a previously anodizing of the MMC. Anodizing conducted in phosphoric acid (P) is better than in oxalic (O) and sulfuric (S) acids. Cyclic anodic potentiodynamic polarization curve (CAPPC) in P shows a positive hyteresis with higher current density and greater gap between the forward and reverse scans. Scanning electron micrograph (SEM) depicts that the surface anodized in P is cleaner and smoother than anodized in O and S. Electrochemical impedance spectroscopy (EIS) demonstrates that the film produced in P has smaller resistance and capacitance. Cyclic cathodic potentiodynamic polarization curve (CAPPC) for the anodized MMC was applied to estimate the decomposition potential (DP) and crossover potential (COP) in copper sulfate. The value of DP is P＞O＞S but NOP reverses the order. The higher the DP, the more readily of copper plating; the less the NOP the easier nucleation of the deposits. Thus, the MMC previously anodized in P tends to obtain a refined and dense copper coat.

並列關鍵字

7005/Al2O(subscript 3(P)) metal matrix composite ； anodizing pretreatment ； copper plating ； cyclic potentiodynamic polarization