Title

一種環保型電子封裝用複合材料

Translated Titles

Environment Protection Composite for Electronic Package

Authors

修子揚(Zi-Yang Xiu);張強(Qiang Zhang);宋美慧(Mei-Hui Song);朱德志(De-Zhi Zhu);武高輝(Gao-Hui Wu)

Key Words

複合材料 ; Sip/Al-Si20 ; 熱膨脹 ; 熱導率 ; 電子封裝 ; composite ; Sip/Al-Si20 ; thermal expansion ; thermal conductivity ; electronic package

PublicationName

電子元件與材料

Volume or Term/Year and Month of Publication

24卷12期(2005 / 12 / 05)

Page #

20 - 22

Content Language

簡體中文

Chinese Abstract

採用擠壓鑄造專利技術製備了體積分數為65%高純Si的環保型Sip/Al-Si20複合材料。試驗結果表明:複合材料的鑄態組織均勻、致密,沒有明顯的顆粒團聚和偏聚,也不存在微小的孔洞和明顯的缺陷;Sip/Al-Si20是一種輕質(密度為2.4g立方公分)、低膨脹係數(7.77×10^(-6)℃^(-1))、高熱導率[(156.34W/(m•℃)]複合材料,電導率為4.08Ms/m,具有較高的比模量和比強度;Sip/Al-Si20複合材料可以進行鍍Ni和封裝焊接。

English Abstract

The environment protection Sip/Al-Si20 composite, with high purity silicon of large content (65%) were fabricated by squeeze-casting method. The results show that the composite are dense and Si particles distributed uniformly. And no holes and obvious defects are observed. The Sip/Al-Si20 composite has low density (2.4 g/cm^3), low CTF. (7.77×10^(-6)/℃), high thermal conductivity [156.34 W/(m•℃)l and an electronic conductivity of 4.08 MS/m as well as higher special modulus and special strength. The Sip/Al-Si20 composite also can plate nickel and weld packaging.

Topic Category 工程學 > 工程學總論
工程學 > 電機工程