In this study, a micro copper fuse was developed on glass epoxy plate by wet etching technology. The fuse structure has a length of 600μm and a width of 80μm.The thickness of the copper layer is 30μm. Numerical simulation was studied with ANSYS software to predict the temperature distribution of micro fuse with variation of input voltage. Different cross-section area of micro fuse was obtained from controlling etching time. The characteristic of the fuse were evaluated experimentally by input power to its blowing current with an increment of 0.1A. Measured temperature showed a good agreement with the simulation data. Under safety standard test requirement, the normal rated current of the design micro fuses are 1.15A, 1.60A and 2.10A at an input voltage of 3.6V.