BGA無鉛複合銲錫之機械性質

Mechanical Properties of Composite Pb-free Solder Joints In Ball Grid Array

陳昱璋(yu-jang Chen)

指導教授 ： 李文興

國立臺北科技大學/機電學院/製造科技研究所/碩士(2010年)

https://doi.org/10.6841/NTUT.2010.00456

摘要

本研究主要是探討以鎳和鐵兩種元素來強化複合銲材改善用於球陣列構裝之銲料機械性質。研究中是在無鉛錫Sn3Ag0.5Cu銲材中添加大小10~15μm之Ni金屬顆粒(1wt%、3wt%)與添加大小50~70μm之Fe金屬顆粒(1wt%、3wt%)，製作成無鉛複合銲錫合金球，以探討Ni金屬顆粒與Fe金屬顆粒的添加，對錫基材與銲錫接點的微結構與機械性質之影響。研究結果顯示，基材添加Ni金屬顆粒與Fe金屬顆粒後，是可以達到散佈強化的效果，在添加Ni金屬顆粒的複合材料，硬度可從HV13.21增加至添加3wt%的HV16.18，在添加Fe金屬顆粒的複合材料，硬度可從HV13.21增加至添加3wt%的HV16.80。另外，推球試驗顯示無添加金屬粉末之接點強度為8.08N，添加3wt%鎳的接點強度提高則為9.96N，添加3wt%鐵的接點強度提高則為11.57N，且每個接點破壞呈現延性破壞斷面特徵。拉球試驗則也使接點強度從13.24N，添加1wt%鎳的接點強度增加至16.18N，添加3wt%鐵的接點強度增加至17.44N。透過試驗可得知，添加鎳金屬顆粒與鐵金屬顆粒可增加基材硬度，在製作成錫球後，透過推球試驗與拉球試驗也可得到強化效果。

關鍵字

BGA ； 無鉛復合銲錫 ； 械性質

並列摘要

This study mainly investigates the usage of the elements-Nickel(Ni) or Iron(Fe) to strengthen the welding composite material and improves their mechanical properties as a solder in the application of Ball Grid Array .In this study ,a 10~15μm of Ni metallic particles(1wt%、3wt%) or a 50~70μm of Fe metallic particles(1wt%、3wt%) was added to the unleaded solder Sn3Ag0.5Cu to make unleaded composite solder alloy in order to investigate the effect of the additives of Ni or Fe particles on the microstructures as well as the mechanical properties of between Sn substrate and the silver soldered joint.
The experimemted results showed that adding Ni or Fe particles to the substrate has a spreading enhancement effect .With Ni particles(3wt%) added will increase the hardness of the compound material from HV13.21 to HV16.18.On the other hand,added with Fe particles(3wt%) will increase the hardness of the compound material from HV13.21 to HV16.80.Furthermore,the push ball test shows a none metallic powder added solder joint strength is 8.08N,but the solder joint strength can be increased to 9.96N for 3wt% of Ni particles added and to 11.57N for 3wt% of Fe particles added .In addition ,the failure mode of the joint observed shows the feature of ductile fracture at the surface. The pull ball test also indicates the solder joint strength of 13.24N can be increased to 16.18N for 1wt% of Ni particles added or to 17.44N for 3wt% of Fe particles added.

並列關鍵字

composite pb-free solder alloy ； ball grid array package

參考文獻

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