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  • 學位論文

中孔洞二氧化矽之改質及其在高頻印刷電路板之應用

Modification of Mesoporous Silica and it's Application on High Frequency Printed Circuit Board

指導教授 : 陳玉惠
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摘要


隨著時代的演進,積體電路元件尺寸不斷的朝向輕、薄、短、小而前進,而使用高頻印刷電路板來做為電子零件之基板是目前一大趨勢,也是呈現高速訊號傳輸速度及高度訊號傳輸品質及滿足高密度線路連接的首要選擇。 本研究主要利用溶膠-凝膠法和自組裝之技術,探討不同的反應條件對所合成之中孔洞二氧化矽(MCM-41及SBA-15)以及在SBA-15中添加擴孔劑,作一系列之研究;再經由場發掃描式電子顯微鏡對其型態做一適當選擇,經選定其二氧化矽分別以HMDS及HMDS/TMCS進行表面修飾以獲得疏水之性質,經X光粉末繞射儀及穿透式電子顯微鏡進行鑑定及證明保有其原有之完整結構,再以紅外線光譜儀和氮氣吸/脫附儀證明其疏水性改質及末端之TMS官能基。 以改質後之MCM-41-m及SBA-15-m為填充物與氟系高分子作一適當混摻,經適當處理及壓製後得PTFE/MCM-41-m及PFFE/SBA-15-m兩組氟系複合高頻基板,由場發掃描式電子顯微鏡及能量分散光譜儀觀察其分散性皆屬良好,而以介電儀及吸水率測試顯示PTFE/MCM-41-m之氟系複合高頻基板性質較PTFE/SBA-15-m之性質為佳,顯示其中Dk值介於1.7~2.16之間,Df值則介於0.0008~0.0049之間,其CTEz值更可降至11.8ppm/℃,能有效改善高頻印刷電路板所需各性質。

並列摘要


In the contest of present day market treads in electronic and microelectronic devices that call for efficient use of device space, the use of high frequency printed circuit boards as foundation plates for electronic components are attractive. The main advantages of high frequency printed circuit boards are high speed, high quality of signal transmission and high density interconnections. In this study, we mainly used the sol-gel joint and self-assembly technology, to synthesize silicon dioxide (MCM-41 and SBA-15). The 1.3.5-trimethylbenzene was used to increase pore size in SBA-15, and then modified the surface by HMDS and HMDS/TMCS respectively. The X-ray powder diffraction and the transition electron microscope evidenced the nitrogen adsorption/desorption process, thereby confirmed the complete structure. The infrared spectra proved the hydrophobic property by indicating the changes in the TMS of functional group. Two different types of fluorine composite printed circuit boards (PTFE/MCM-41 and PTFE/SBA-15) were prepared by suitably mixing PTFE with modified MCM-41-m and SBA-15-m as fillers. The dispersity was found good using field emission scanning electron microcope and energy disperse spectrum. The water absorptivity test showed that PTFE/MCM-41-m board is better than the other. Further the properties like Dk value (varying between 1.7 to 2.16), Df value (varying between 0.0008 to 0.0049), and CTEz (fall of 11.8ppm/℃) were measured. From the above properties it was found that these materials are suitable for the preparation of high frequency printed circuit boards with various natures.

並列關鍵字

Mesoporous PCB Silica

參考文獻


(30) Jie Fan, Chengzhong Yu, Limin Wang, Bo Tu,Dongyuan Zhao, Yasuhiro Sakamoto, and Osamu Terasaki, J. Am. Chem. Soc. 2001, 123.
(19) Wu, C. N., Liao, C. N., Tsai, T. S., Chao, K. J., Microporous Mater. 1996, 7, 173.
(48) David J. Arthur et al. U.S. Pat. No. 5, 149, 590, Sep.22, 1992.
(5) S. Khan, Circuit World, 2000, 26, 33.
(11) N. Santhanam, IEEE, 1999, 65.

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