奈米導電膠在環氧樹脂基材之製備與性質研究

Preparation and Characterization of the Nano-clay/Polyaniline Hybrids in Epoxy Resin Matrix

黃柏源(Po-Yuan Huang)

指導教授 ： 蔡宗燕

中原大學/理學院/化學研究所/碩士(2005年)

https://doi.org/10.6840/cycu200500515

摘要

摘要
由於聚苯胺因具有導電之特性，且價格便宜、質輕易加工成型等優點。因此開發奈米級導電膠對於防止電子產品短路、抗靜電、抗電磁波…等防護材料乃具有相當大的市場潛能。且未來電子產品趨向於小型化、輕薄化，電子元件容易受電子雜訊干擾，而這些雜訊來自於靜電放電（ESD，Electrostatic Discharge）、電磁波干擾（EMI，Electromagnetic Interference）…等，容易造成電子元件短路。因此在製造、運送、儲存乃至於最後產品的使用均需要防護材料，防止電子產品的短路。
本研究中，首先製備有機改質型黏土，再與苯胺單體進行聚合反應，製備出具導電性之PANI/Clay奈米複合材，進一步添加入環氧樹脂中。探討不同種類的黏土與大、小質子酸之導電度的差異性及在環氧樹脂中之導電性，並利用GPC來探討分子量大小與導電度、黏土種類及不同質子酸之間的關係，再利用XRD、TEM檢測黏土在聚苯胺及環氧樹脂中的分散情形，同時利用熱重分析儀（TGA）及動態機械分析儀（DMA）觀察其熱穩定性及探討玻璃轉移溫度（Tg）的變化。

關鍵字

聚苯胺 ； 環氧樹脂 ； 黏土

並列摘要

Abstract
Polyaniline has been attracted considerable interest because of its electric conduction、low cost and simple processing and so on. In this work, polyaniline-modified clay hybrids in the epoxy matrix were studied. Some potential advantages are expected, such as preventing a short circuit of the electronic product、antistatic、resisting an electromagnetic wave, etc. These kinds of protective materials have potential application in commercial markets. The smaller, thinner and lighter electronic products are easily interfered by the electronic noise which comes from electrostatic discharge and electromagnetic interference, etc. This noise will cause the short circuit of the electronic device. Therefore protective materials provide the prevention of the short circuit of the electronic device in the process of preparation, transportation, storage and usage.
In this research, organically modified clays are prepared and then followed by polymerization with aniline monomer to make PANI/Clay hybrid which provide the electric conductivity. After that, mix with epoxy resin. Comparison of clay types, conductivity of polyaniline doped with small proton acid and/or large proton acid, and conductivity of epoxy-polyaniline/clay nanocomposites. Molecular weight of polyaniline/clay nanocomposites was measured by GPC. Finally, apply XRD, TEM, TGA and DMA measurements to observe the thermal and mechanical properties.

並列關鍵字

Epoxy ； Clay ； Polyaniline

參考文獻

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