本研究藉由瞭解印刷電路板製造過程中防焊製程在整個環節的重要性與所屬特性,進而應用精實六標準差DMAIC的結構化手法,發展出定義、衡量、分析、改善、控制為架構的防焊製程品質管制計劃,提供現場作業人員當品質發生異常時能迅速排除及解決問題的參考方向,進一步降低解決問題的時間,促進與提高生產效率。 本管制計畫之建構可以依據各單位不同的主流程分別建置,累積問題的發生與改善對策的經驗做為預防措施,最後進化成作業時的相關注意與管制事項,也可做為公司技術力累積的基礎。 另外本研究在結果與討論中也以精實的觀點探討印刷電路板製造廠中有關消除八大浪費的建議事項,以提供印刷電路板製造廠做為參考意見。
This study aims to probe the characteristics of solder mask in printed circuit board manufacturing, and also by using the lean six sigma (DMAIC) structure approach to develop the processes (Define, Measure, Analyze, Improve, and Control) to perform solder mask quality control plan. The developed process will be provided to enable the field operator as procedure in order encountered quality issue can be recovered and resulted swiftly, and by it to reduce problem solving time and improve the production efficiency. This quality control plan can be built by departments based on their main flow, and by those accumulated experience in resulting issues to form the preventive actions and finalize those actions to be the field operation standard procedure to improve the company capability in sealing quality issues. In this study, suggestion related to eliminate eight wastes in printed circuit board manufacturing will be also provided as reference based on the lean manufacturing approach.
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