考量時間價值於IC封裝打線機之偏移生產問題

台灣半導體產業在經過數十年的努力，已開創出優異的成果，且Gartner(國際研究暨顧問機構)於2013年4月的統計中，發現全球前五大封裝測試業者有三個是台灣本土公司(日月光、矽品、力成科技)，由此可知台灣的IC封裝製程在國際間佔有非常重要的一席之地。而IC封裝製程中的打線機台，除了是整個製程中的瓶頸機台外，也是整個製程中設備投資比例最高之機器設備(約占50％)，故本研究針對在打線機台的生產情境中，所會遇到的生產問題進行研究與探討。本研究在經過專家訪談後確認三大主要影響機台偏移而製造出不良品之關鍵模組，分別為鋼嘴下壓力量控制模組、超音波震盪頻率控制模組與底板預熱溫度控制模組，且此三項關鍵模組在不良品發生之原因比例中占了90％。除了考慮打線機台偏移之生產問題外，另加入時間價值與通貨膨脹之議題，來建構其數學模式，推導出模式的數學特性與有效求解範圍，經以MacLaurin Series取代原指數函數項，可獲得簡易近似解，能提供使用者快速找到最佳生產週期時間，進而求得最小總生產成本。最後，透過實際數據與Bisection演算法，驗證此近似解法仍具有良好的求解品質，且藉由參數調整來提出管理上的改善策略與方法，以協助決策者改善產線的狀況，並達到總生產成本降低之目標。

關鍵字

打線機台； IC封裝產業；不完美製程；經濟生產批量；時間價值；通貨膨脹

並列摘要

The semiconductor industry in Taiwan has achieved excellent performance in the past decades. Gartner’s statistics in April 2013 found that three of the top five global packaging and testing companies are from Taiwan, including ASE, SPIL, and PTI, thus proving the important role of Taiwan in the global IC packaging industry. In the IC packaging process, the wire bonding machine is often a bottleneck, and also requires a high investment, at approximately 50% of the equipment Investment. Thus, this study focuses on wire bonding machines production problems in the IC packaging process. Based on situational interview, this study has identified three key control modules, namely, the capillary tip under the pressure force control module, the lead frame temperature control module, and the thermosonic bonding power control module, which affect machine changes and create defect key modules, and are responsible for 90% of the occurring defect products. In addition to wire bonding machine problems, this study considers time value and the inflation to build a mathematical model, where the exponential function terms are replaced by the MacLaurin Series, and also identifies the math properties and a range of solutions to get an approximation solution. Its objective is to determine the optimal production cycle time and then to obtain the minimal total cost. Finally, this study applies the bisection method with practical data to justify the approximated solution’s quality and explores the managerial insights from observed outputs through the changes of various parameters. The solution approach is expected able to serve as a reference for practical decision-making to reach the minimized total cost purpose.

並列關鍵字

imperfect production system ； IC packing industry ； economic production quantity ； time value ； wire bonding ； inflation

參考文獻

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考量時間價值於IC封裝打線機之偏移生產問題

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