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  • 學位論文

有限計劃期間內半導體CMP機台之偏移生產問題研究

Study on a CMP Machine’s Shifting Production Problem within a Finite Planning Horizon

指導教授 : 宮大川

摘要


在半導體積體電路製造業中,製程技術有微細化的趨勢,將積體電路導向高密度、高積度、高性能的目標發展,造成積體電路表面的凹凸程度增加,導致其它製程產生問題,因此,選擇現階段唯一能提供半導體積體電路製造全面平坦化技術,並且符合製程技術微細化的化學機械研磨機,來解決積體電路表面凹凸的問題。相對地,化學機械研磨機的品質就非常重要,根據表面移除速率得知化學機械研磨機的關鍵模組為研磨頭下壓力量控制模組和研磨台迴轉速度控制模組,並且發現在化學機械研磨機的生產過程中,當生產經過一段時間之後,其關鍵模組會發生偏移,使製程生產出不良品,不良品會直接丟棄,而且必須於有限計畫期間內達到一定生產數量以滿足需求。因此,本研究對化學機械研磨機的生產問題進行探討,並且依照化學機械研磨機之兩個關鍵模組所衍生出的生產情況,即兩個關鍵模組皆未偏移、其中一個關鍵模組發生偏移、兩個關鍵模組皆發生偏移,一旦偏移就會產生不良品,建構出經濟生產批量模式,尋求有限計畫期間內之最佳生產週期的期數,使總生產期望成本最小化,並且透過調整特定參數來進行敏感度分析,觀察其變化和趨勢,以改善產品於生產計畫的生產週期之期數或生產時間為目的,而且提供決策者在規劃生產計畫之參考。

並列摘要


Regarding semiconductor manufacturing of the integrated circuit, technologies tend toward miniaturization, where integrated circuits are developed with a focus on high-density, high-volume, and high-performance. State causes the surfaces of integrated circuits to be uneven, which results in other problems of process. Therefore, this research selects the chemical mechanical polishing machine, which can prevent the uneven problem from occurring frequently, and is a phased technology to render the surface to achieve global planarization. The technological requirement of miniaturization can be satisfied to solve the uneven surface problem of integrated circuits. Contrarily, the quality of the chemical mechanical polishing machine is very important. Based on the main polishing rate, chemical mechanical polishing is done by two unreliable key modules, the pressure control module, and the rotation control module. A production problem is determined in the process of the chemical mechanical polishing machine, and during a production run, the two unreliable key modules will shift from an in-control state to an out-of-control state. A portion of the items that the chemical mechanical polishing machine produces is defective, and such defectives are discarded. However, the chemical mechanical polishing machine must produce a fixed number of products to satisfy demand over a finite planning horizon. This study discusses chemical mechanical polishing machine production problems. According to the chemical mechanical polishing process, the two key modules may shift to an out-of-control state due to different production situations, where both key modules are in-control, one key module is out-of-control, and both key modules are out-of-control. Once a key module shifts to an out-of-control state, certain amount of defects will be generated. The Economic Production Quantity model is proposed by this study, and its objective is to determine the optimal number of production runs over a finite planning horizon to minimize expected total costs. Finally, a numerical example is provided to illustrate the model. Meanwhile, sensitivity analysis is performed to provide suggestions that improve the number of production runs or production uptime in production planning.

參考文獻


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