Title

銲料與基材中添加鐵對界面反應之影響

Translated Titles

Effects of Fe Additions upon Interfacial Reactions between Solders and Substrates

Authors

魏家昱

Key Words

Sn-Zn-Cu ; Sn-Cu-Fe ; Co-Fe ; Sn-Zn-Cu ; Sn-Cu-Fe ; Co-Fe

PublicationName

中原大學化學工程研究所學位論文

Volume or Term/Year and Month of Publication

2017年

Academic Degree Category

碩士

Advisor

陳志吉

Content Language

繁體中文

Chinese Abstract

本論文探討將Fe分別添加至純Co基材與Sn-Cu銲料中對界面反應的影響,實驗結果顯示當Sn-Zn-Cu銲料與Co-Fe基材反應時,會隨著Fe的添加而降低介金屬相的生成厚度;當Sn-Cu銲料中添加Fe不會影響界面反應,會增加Cu6Sn5相的生成厚度,但對CoSn3相的生成厚度影響不明顯。 研究顯示,Fe的添加會誘發(Co, Fe)Sn2相的生成,在Co-5wt%Fe基材與Sn-2wt%Zn-1wt%Cu銲料反應時,生成相會由CoSn3相轉而生成(Co, Fe)Sn2相。當Co-5wt%Fe基材與Sn-5wt%Zn-1wt%Cu銲料反應時,則是由T1(Sn2ZnCo) 相轉而生成(Co, Fe)Sn2相。當銲料中Zn添加至9wt%時,10wt%Fe添加至純Co基材中會使界面處生成(Co, Fe)Sn2相。而基材中添加越多Fe時,(Co, Fe)Sn2相生成的就越慢。在Sn-Zn-Cu/Co-Fe反應中釐清添加Zn與添加Fe的效應。而當Fe添加至Sn-0.7wt%Cu銲料中時,情況與添加至純Co基材完全不同。當Fe添加至Sn-0.7wt%Cu銲料中與純Cu基材反應時,不影響界面反應,但會促使Cu6Sn5相的生成,且添加越多Fe時,Cu6Sn5相生成的越快。Fe添加至Sn-0.7wt%Cu銲料中與純Co基材反應時,不影響界面反應也不影響CoSn3相的生長速率。

English Abstract

This study investigates effects of Fe additions upon interfacial reactions between solders and substrates. The experimental results show that when Sn-Zn-Cu solder reacts with Co-Fe substrate, thickness of IMCs will decrease with the addition of Fe. The addition of Fe into Sn-Cu solder will not affect the interfacial reaction of Sn-Cu/Cu reaction couples, but it will increase the thickness of Cu6Sn5 phase. When Fe is added in solders of Sn-Cu/Co raction couples, it will not affect the interfacial reaction of Sn-Cu/Co and thickness of CoSn3 phase. According the results, Addiotion of Fe can induce the formaition of (Co, Fe)Sn2 phase, When Co-5wt% Fe substrate reacts with Sn-2wt% Zn-1wt% Cu solder, IMC is (Co, Fe)Sn2 phase instead of CoSn3 phase. When Co-5wt% Fe substrate reacts with Sn-5wt% Zn-1wt% Cu solder, the (Co, Fe) Sn2 phase is formed, not T1 (Sn2ZnCo) phase. When addiotion of Zn is reached to 9wt% in solder, it need to be added 10wt% Fe to the pure Co matrix to be formed (Co, Fe) Sn2 phase at the interface. And the more Fe is added to the substrate, the (Co, Fe) Sn2 phase becomes thinner. In Sn-Zn-Cu/Co-Fe reactions, the effect of Zn and adding Fe was clarified. And when Fe is added to Sn-0.7wt%Cu solder, the situation is completely different from the addition to the pure Co substrate. When Fe is added to the Sn-0.7wt%Cu solder, it reacts with the pure Cu substrate without affecting the interfacial reaction, but it will promote the formation of Cu6Sn5 phase and it will faster as more addiotion of Fe. When Fe is added to Sn-0.7wt% Cu solder, it does not affect the interfacial reaction between Sn-0.7wt%Cu and Co, and does not affect the growth rate of CoSn3 phase.

Topic Category 工學院 > 化學工程研究所
工程學 > 化學工業
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