軟性電路板隨著消費性電子產品與高性能產品的發展,大量地被使用在3C電子產品上。其中卷對卷製程因其低成本高效率特性廣泛被應用在軟性電路板生產中。卷對卷製程的材料張力變化會影響生產品質,保持材料張力的穩定為提升品質的必要方法。 本文設計出一種新的機構來克服卷對卷製程中雷射鑽孔機所產生銅箔材料的張力不均現象,避免變形與褶皺的生成。其機構主要是由伺服馬達、磁粉離合器、定滑輪、張力檢知器與鋼索所組成。機構主要是設計控制動滑輪組的高低位置,由張力檢知器所量測的數據來分辨動滑輪組與銅箔材料的接觸狀態,驅動伺服馬達輸出高轉速或低轉速,維持銅箔材料張力的穩定。經與過去僅有動滑輪組作為張力控制的實作比較,新的機構設計能改善銅箔材料長寬變形量達40%。
As the consumer products and high end products continue to expand, there have been many advanced manufacturing technology in Flexible Printed Circuit Boards used for mass production of 3C products. Roll to Roll technology is one of flexible printed circuitry processes which is low cost and high efficiency widely used in fabrication of flexible PCBs. Change of material tension will significantly influence the production quality in the Roll to Roll manufacturing process. Maintaining the material tension is therefore very important to improve the quality control of flexible printed circuit board. A new manufacturing mechanism is designed to overcome the problems of non-homogeneous tension happened in the copper coated film in the process of laser drilling so as to avoid the copper coated film encountered deformation and folding layers. Such a mechanism is consisted of servo motor, magnetic clutch, fixed pulley, tension detecting device and steel cables, etc. The mechanism is able to control the location of rolling pulleys. The contact status between rolling pulley and copper surface is measured by the sensor. Via the adjustment of servo motor’s speed, copper coated film tension is controlled steadily. The past just-rolling pulley manipulation compares with the new practical control. The innovated design of new mechanism should improve the copper coating film’s length and width deformity up to 40%.