指紋辨識元件之折彎貼合模組設計

摘要論文所探討指紋辨識元件之折彎貼合模組設計，為設計開發一種微小型繞性元件的精確貼合技術。超音波技術的指紋辨識元件，有別於一般的指紋辨識，在FPC前端的感應及發射單元都需要另行裝貼在TFT上，在多層元件複合的晶片上，自動對位辨識相對較為困難，而且在FPC與TFT二個元件之間Bonding電路導通的軟式排線，將二個元件連結起來，在完成位置辨識後，位置補正並不能以二個獨立的個體去處理，其位置補償方法是以該工件的特性而設計，其中包括了二種不同的方法的應用來處理二個元件排線連接，造成補償偏移的問題。第一個方法是XYθ三個軸向的標準補償式配合X方向的旋轉補償量，來輔助處理工件偏移的誤差，這個方式可以有效的把偏差量降低，但仍有一些不穩定的因素存在，X方向的旋轉補償量與角度偏差並沒有辦法完全吻合，造成貼合精度較差，致使在綜合製程能力指數(Process Capability Index, Cpk)的表現上無法滿足製程規格；第二個方法是直接避開造成工件偏移的X方向補償，僅使用Y軸及θ軸來處理工件的偏差量，此法雖然存在固定的計算誤差，但卻排除了工件拉扯偏移的誤差量，在犧性部份製程準確度(Capability of Accuracy, Ca)值的條件下，可提高貼合的製程精密度(Capability of Precision, Cp)值，對整體製程的Cpk反而有提升的效果，實測三個量測點的Cpk驗證，都可以達到1.33以上的製程規格。關鍵字: 貼合技術、視覺對位、指紋辨識、製程能力指數(Cpk)

關鍵字

貼合技術；視覺對位；指紋辨識；製程能力指數(Cpk)

並列摘要

Abstract A micro-wound element is designed for the bending and fitting module of the finge rprint identification. The ultrasonic fingerprint identification component is different from the general fingerprint identification since the launch units in front of FPC need to be attached to the other side of the TFT. Automatic alignment is more difficult than the composite chip of multi-layer component. The bonding circuit conduction of the soft cable between the FPC and the TFT combines them. After the completion of position identification, the position compensation cannot manage only two independent individuals. The position compensation method is designed with the characteristics of the workpiece, which includes two different methods to deal with two component cable connection. As a result, compensation offset problem occurs. The first method is the three axial (XYθ) standard compensation with respect to the rotation compensation amount along the X direction. This method can effectively reduce the amount of deviation, but some unstable factors still exist. Because the X-direction rotation compensation amount and the angle deviation cannot fully match, bonding accuracy is not acceptable that makes performance of Cpk cannot meet the process specifications. Avoid from the workpiece offset caused by the X-direction compensation, the second method deal with the amount of deviation of the workpiece using the Y-axis and the θ-axis that can exclude the offset error due to workpiece stretched and pulled though with a fixed calculation error. At the sacrifice of Ca, high efficiency of Laminating Cp value is increased, that improve the entire process of Cpk. In practice, the measured Cpk verification of three testing points can reach above 1.33. Keywords: Laminating technology、fingerprint identification、visual alignment、Cpk(Complex Process Capability index)