提升介電層厚度均勻性之緩衝墊設計

熱壓合製程為電路板製造流程中極為重要的一環，其主要目的是利用半固化膠片(Pre-pregnant)將銅箔與內層線路板進行接合。在壓合製程中緩衝墊有減壓、保溫、吸濕等作用，對於壓合後成品之介電層有極大的影響力。本研究目的在執行緩衝墊的改善設計以提升壓合後電路板介電層厚度均勻性，利用電腦輔助分析軟體(COMSOL)進行新型緩衝墊設計與壓合模擬，並將改良後的緩衝材料送入壓合制程中進行實驗，與舊型緩衝墊壓合結果比較，證實此新型緩衝墊壓合後成品之介電層平整度較舊型緩衝墊之平整度提升了1.8μm，明顯優於舊型緩衝墊，達到改善製程與提升產品良率之目標。

關鍵字

電路板；壓合制程；半固化膠片；緩衝墊；介電層

並列摘要

Lamination process is the most important process in the manufacture of circuit boards, the main purpose is to use the Pre-pregnant bonding the copper foil and the inner layer of the circuit board. In the lamination process, cushion pad has insulation, pressure, and moisture effects. Moreover, there is a great influence of cushion pad for the finishing product of the dielectric layer. The aim of this study is improving the design of the cushion to enhance the board dielectric layer thickness uniformity. This research is using the commercial computer aided package COMSOL was used to design a new cushioning pad and simulate the lamination process. The new designed cushion was then tested in the production line to compare the performance with the old one. Experimental results show that the thickness uniformity of the dielectric layer was enhanced 1.8 μm than the old type cushion.The study has reached the goal which is making the process better, and upgrading the quality of the product.

並列關鍵字

circuit board；Lamination process；Pre-pregnant；cushioning pad；dielectric layer.

參考文獻

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國際替代計量

提升介電層厚度均勻性之緩衝墊設計

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